External Substrate Clamping for Uniform Plating on Large Panels
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Solution Overview
Problem
Conventional plating technologies face challenges in efficiently processing large substrates due to complex substrate holding devices, which complicate operations and may lead to uneven plating quality and increased production costs.
Innovation Solution
A plating apparatus with a simplified structure that fixes substrates on the outer side of the tank body using a fixing device with clamping pieces driven by mechanisms, allowing for easy mounting and sealing, and a plating solution drive device for uniform coating distribution, along with a cleaning module for maintaining sealing element integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate holding devices are used, then substrates can be held during plating, but the structure becomes complex and operation becomes difficult
Solution Approach 1:
The patent extracts the substrate holding function from the tank body structure itself, placing the holding device on the outer side of the tank body. This separates the holding function from the plating chamber, simplifying the overall structure while maintaining substrate holding capability during plating operations
Solution Approach 2:
Instead of holding substrates from inside the tank body, the patent inverts the approach by holding substrates on the outer side of the tank body. The holding device is positioned externally, and substrates are held in an inverted state relative to conventional approaches, simplifying the internal tank structure
2Reliability
If complex substrate holding devices are used, then substrates can be secured, but operation time increases and production efficiency decreases
Solution Approach 1:
The patent employs a dynamic holding device with movable clamping pieces that can be quickly adjusted between clamped and released states. This dynamic mechanism allows rapid substrate loading and unloading, significantly reducing operation time while maintaining secure substrate fixation during plating
Solution Approach 2:
The holding device is pre-configured with clamping pieces positioned to automatically engage with substrates. The preliminary positioning of clamping mechanisms allows for quick substrate capture and fixation without requiring complex manual adjustment during operation, improving production efficiency
3Reliability
If conventional plating apparatus are used, then plating can be performed, but plating solution distribution is uneven leading to inconsistent coating quality
Solution Approach 1:
The plating solution drive device is segmented into multiple independent driving units distributed across the tank body. Each unit independently drives plating solution flow in its local region, ensuring uniform solution distribution and consistent plating thickness across the entire substrate surface
Solution Approach 2:
The plating solution drive device incorporates feedback mechanisms that monitor solution flow and distribution patterns. Based on feedback information, the system adjusts the driving force of individual units to maintain uniform plating solution distribution and consistent coating quality across the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances production efficiency, ensures uniform plating thickness, reduces operation time, and improves yield while reducing costs by simplifying substrate handling and maintaining plating solution consistency.
Implementation Method 1
a plating solution drive device disposed in the tank body and facing the opening, and configured to drive the plating solution to flow towards the opening
Implementation Method 2
a cleaning module for maintaining sealing element integrity
Implementation Method 3
a fixing device configured to fix the substrate at the opening of the side wall
Implementation Method 4
Plating is a process in which a certain metal surface is plated with a thin layer of other metal or alloy using electrolysis principle
Data Source
AI summary
A plating apparatus and a plating method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; a fixing device configured to fix the substrate at the opening of the side wall; at least one sealing element disposed around the opening; and a cleaning module coupled to the tank body for cleaning the at least one sealing element. A cleaning method is also provided for cleaning the at least one sealing element with the cleaning module after operation of the plating apparatus.