Tanks TRIZ Cases

A thin electroplated bismuth layer blocks silver tarnish and gold corrosion while preserving low contact resistance after thermal aging.

A nanometer-scale bismuth electroplate blocks silver tarnish and gold corrosion while preserving low contact resistance after thermal aging.

Alternating gold plating and etch steps clears spurious Au at via openings, enabling uniform through-silicon mask fill without voids.

A rail-mounted transfer robot boosts substrate handling speed while keeping clean air over the processed surface to suppress particle adhesion.

A nanometer-scale electroplated bismuth layer protects silver and gold from tarnish and corrosion while preserving low contact resistance after thermal aging.

Electrochemical bonding in an electrolyte joins porous conductive layers into 3D metal structures without high-temperature processing.

Independent inner and outer anodes enable fast nickel plating of spark plug housings with controlled thickness and selective surface coverage.

Reciprocating, misaligned nozzles widen PCB spray coverage, eliminating blind spots and improving electroplating uniformity.

Pressurized liquid apertures create a tangential flow field that holds thin planar workpieces flat during wet processing, avoiding contact damage.

External clamping at the tank opening simplifies large-substrate plating while improving coating uniformity and seal cleanliness.

An electrically conductive chain carries loads and current through immersion stations, supporting continuous electrophoretic coating during hoist movement.

Pressure-driven liquid flow stabilizes thin workpieces for uniform wet processing.

A long-term sulfur-free mold coating prevents contamination, bypassing energy-intensive electrolysis.

Directional electrolyte flow in a roller-free housing targets specific belt areas, reducing waste while improving sanitation.

Segmented hole patterns in a high resistance virtual anode compensate for edge effects to achieve uniform conductive layer thickness on large wafers.

A nozzle sprays low conductivity fluid onto an electroplating web to remove residual liquid, preventing poor electrical contact and uneven coating.

Inverted injection nozzle directs electrolytic solution upward through a mask recess to generate swirling fluid motion.

Segmented process chambers enable automated anode replacement and flexible treatment of substrates with different dimensions.

Protective walls and liquid immersion capture dust from transferring mechanisms, preventing contamination of treatment solutions.

Intermeshing rotating disks extend contact time to coat short structures uniformly while compressing device length.

Segmented storage and coating containers minimize moisture ingress into sensitive ionic liquids during electrolysis.

Opposing fluid flow segments maintain treatment uniformity at high transport speeds while minimizing mechanical stress on fragile substrates.

Variable overlap through holes in a segmented plating resistor adjust the electric field to improve film uniformity without frequent component replacement.

A plating apparatus uses a movable block member to reduce the gap between the substrate holder and the tank wall.

An edge flow element directs electrolyte into substrate corners to promote shear flow and improve plating uniformity.

Segmented plating heads eliminate labor-intensive masking steps while maintaining solution purity through static anode positioning.

A vertical plating system uses a dual clamping gripper to retain work pieces during transport and treatment.

Rotating receptacles on shafts eliminate robotized arms by using oscillation for cleaning and tilting for transfer, reducing bath consumption.

Multiple inlet and outlet pipes with controlled flow devices switch processing liquid direction while maintaining constant overall flow rate.

Electrolytic plating deposits solder wettable material on semiconductor chip package lead lands to create reliable conductive surfaces.

A selective plating apparatus deposits metal on connector contact surfaces using a vibratory linear feeder and vacuum holding system.

Through-holes in the cup bottom allow the elastomeric lipseal to pass through and secure on the rear side, preventing separation that causes wafer sticking.

A combinatorial workflow evaluates chalcogenide materials for non-volatile memory current selectors.

A bulk finishing system moves metal work pieces through liquid immersion tanks using external magnetic conveyors along inclined tank walls.