Intermeshing Disk Cathode for Uniform Electroplating of Short Structures
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Solution Overview
Problem
Existing electroplating devices struggle to provide a sufficiently thick and homogeneous metal layer on short electrically conductive structures due to short contact times and require extensive space for long structures, making it difficult to coat very short structures efficiently.
Innovation Solution
A device with intermeshing disks as the cathode, allowing for closer contact points and longer contact times, enabling the coating of short structures with a thick and uniform metal layer while minimizing space requirements, by using multiple shafts with interlocking disks that can engage closely and rotate to align structures for optimal coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If rollers arranged one behind the other are used to provide long contact time, then coating thickness is improved, but device length increases significantly
Solution Approach 1:
The invention transitions from a linear arrangement of rollers (one behind the other) to a compact intermeshing disk configuration where disks from different shafts engage with each other. This spatial reorganization allows multiple contact points to be achieved in a much shorter device length by utilizing the radial and circumferential dimensions of the rotating disks rather than extending the device linearly.
Solution Approach 2:
The intermeshing disks are arranged such that disks from one shaft engage with disks from another shaft in a nested configuration. The disks are positioned at different radial distances from the shaft axes, creating overlapping engagement zones that maximize contact time within a compact footprint, similar to nested dolls occupying space efficiently.
2Manufacturing precision
If many rollers connected in series are used to achieve sufficient contact time, then coating homogeneity is improved, but device complexity increases
Solution Approach 1:
The invention merges the functions of multiple sequential rollers into a compact intermeshing disk system. Multiple disks on different shafts work simultaneously in an intermeshed configuration, providing multiple contact points and extended contact time without requiring a long series of individual rollers. This consolidation reduces device complexity while maintaining coating homogeneity.
Solution Approach 2:
The invention employs rotating disks that can be independently controlled on different shafts, introducing dynamic elements to the coating process. The rotation of disks creates continuous motion and varying contact pressures across the substrate surface, enhancing coating uniformity while reducing the need for numerous static rollers.
3Adaptability or versatility
If the cathode is positioned far from the substrate to accommodate long structures, then all structures can be coated, but contact time for short structures becomes insufficient
Solution Approach 1:
The intermeshing disk system creates localized contact zones where disks from different shafts engage with the substrate at specific positions. This allows the cathode to be effectively positioned close to the substrate in multiple localized areas simultaneously, ensuring sufficient contact time for short structures while maintaining the capability to coat longer structures that pass through the engagement zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves a more uniform and thicker metal layer on short structures and reduces the overall device size, allowing for efficient coating of short structures and higher throughput with lower operational costs.
Implementation Method 1
the bath containing an electrolyte solution containing at least one metal salt from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer
Data Source
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AI summary
The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.