Substrate Processing Flow Control for Uniform Plating
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving uniform flow of plating solutions during metal plating, leading to non-uniform plating performance and surface profiles, particularly in fine interconnect trenches or vias, due to variations in flow rate and direction.
Innovation Solution
A substrate processing apparatus and method utilizing a plurality of inlet and outlet pipes with flow control devices, controlled by a control section, to smoothly switch the flow direction of the processing liquid without instantaneous changes in flow rate, ensuring a constant overall flow rate and uniform plating solution distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the flow direction of plating solution is reversed repeatedly during plating, then the equalization of flow distribution along substrate surface is improved, but the surface profile of plated film becomes non-uniform (arched profile)
Solution Approach 1:
The system dynamically switches between multiple inlet pipes (first, second, third inlet pipes) and outlet pipes to create flow patterns that change direction over time. This dynamic flow direction switching allows the plating solution to uniformly cover different regions of the substrate surface, improving flow distribution equalization while preventing arched profile formation through controlled temporal variation in flow paths
Solution Approach 2:
The plating solution supply system is segmented into multiple independent inlet pipes (first, second, third inlet pipes) with separate flow control capabilities. Each inlet pipe can be independently activated to create localized flow patterns, allowing precise control over flow distribution across different substrate regions, thereby achieving uniform flow equalization without creating surface profile defects
2Adaptability or versatility
If on-off valve control is used to reverse flow direction, then flow direction switching is achieved, but instantaneous flow rate changes occur causing non-uniform plating performance
Solution Approach 1:
A flow control valve is introduced as an intermediary component between the inlet pipes and the plating tank. This intermediary device provides gradual flow rate adjustment capability, mediating the transition between different flow directions by smoothly modulating flow rate rather than abrupt on-off switching. This eliminates instantaneous flow rate changes and their harmful effects on plating uniformity while maintaining flow direction switchability
Solution Approach 2:
The system changes the flow rate parameter gradually rather than abruptly during direction switching. By controlling the flow rate to change smoothly over time during transitions between different inlet pipe configurations, the system maintains consistent plating conditions throughout the switching process, preventing non-uniform plating performance while achieving adaptable flow direction control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for uniform plating across the substrate surface by maintaining a consistent flow rate during direction changes, preventing non-uniform growth and surface irregularities, thus enhancing plating performance and surface flatness.
Implementation Method 1
a pump for supplying the processing liquid into the processing tank in a circulatory manner through the inlet pipes and the outlet pipes
Implementation Method 2
the inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon switching between the pipes, the flow rate of the processing liquid flowing along the surface of the substrate changes with time
Implementation Method 3
to create a flow of the processing liquid which flows along a surface of the substrate in the processing tank
Data Source
AI summary
A substrate processing apparatus includes a plurality of inlet pipes and a plurality of outlet pipes, connected to a processing tank and configured to be switched therebetween to create a flow of a processing liquid in the processing tank in a direction different from that of the processing liquid before the switching. The inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon the switching, a flow rate of the processing liquid flowing therethrough changes with time.