Integrated Elastomeric Lipseal and Cup Bottom for Wafer Sticking
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Solution Overview
Problem
In electroplating processes for integrated circuit fabrication, the separation of elastomeric lipseals from cup bottoms during wafer removal leads to wafer sticking issues, causing damage and necessitating replacement of electroplating cup assemblies.
Innovation Solution
An integrated elastomeric lipseal and cup bottom design where the elastomeric lipseal is mechanically and/or chemically interlocked with the cup bottom, featuring through-holes for improved adhesion, preventing separation during electroplating and wafer removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the elastomeric lipseal is attached to the cup bottom using conventional methods, then the assembly is simple to manufacture, but the lipseal separates from the cup bottom during wafer removal causing wafer sticking
Solution Approach 1:
The cup bottom is designed with through-holes creating a porous structure that allows the elastomeric lipseal to pass through and be secured on the rear side. This porous design mechanically interlocks the lipseal to the cup bottom, preventing separation during wafer removal while maintaining manufacturing feasibility through standard drilling and assembly processes
Solution Approach 2:
The elastomeric lipseal is positioned to pass through the through-holes of the cup bottom, with portions of the lipseal extending through the holes and being retained on the rear side of the cup bottom. This nested configuration where one component (lipseal) passes through and is retained by another (cup bottom with holes) creates a secure mechanical interlock that prevents separation
2Reliability
If the elastomeric lipseal is made more adherent to the cup bottom, then wafer sticking is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The cup bottom is segmented with multiple through-holes distributed across its surface. This segmentation allows the lipseal to be mechanically interlocked at multiple discrete points rather than requiring a complex continuous bonding process, simplifying manufacturing while ensuring reliable attachment throughout the assembly
Solution Approach 2:
The through-holes are pre-formed in the cup bottom before the lipseal is attached. This preliminary action of creating the hole pattern in advance allows for straightforward assembly where the lipseal is simply positioned and secured through the pre-existing holes, avoiding the need for complex real-time bonding operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design enhances adhesion between the elastomeric lipseal and cup bottom, reducing wafer sticking and extending the lifespan of electroplating cup assemblies by preventing separation during operations.
Implementation Method 1
the elastomeric lipseal directly adheres to the radially inwardly protruding surface
Data Source
AI summary
Disclosed are electroplating cups for holding, sealing, and providing electrical power to wafers during electroplating, where the electroplating cup can include a cup bottom, an elastomeric lipseal, and an electrical contact element. The cup bottom can include a radially inwardly protruding surface with a plurality of through-holes. The elastomeric lipseal can directly adhere to the radially inwardly protruding surface of the cup bottom, fill the plurality of through-holes, and encircle an inner edge of the cup bottom. In some implementations, this can mitigate the effects of wafer sticking. In some implementations, the cup bottom may be treated to promote adhesion between the elastomeric lipseal and the radially inwardly protruding surface of the cup bottom.