External Thermal Management for Image Capturing Devices
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Solution Overview
Problem
Existing image capturing devices face challenges in heat dissipation due to increased processing demands, leading to temperature rises that can damage components and restrict operation times, which hinders convenience and performance.
Innovation Solution
An external electronic device with a heat transfer unit, such as a Peltier element, and a heat dissipation unit, including a heat dissipation fin and fan, is connected to the image capturing device via an interface unit, effectively dissipating heat away from critical components and maintaining device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ventilation duct is disposed inside the image capturing device to cool heat generation bodies, then heat dissipation effectiveness is improved, but device size increases
Solution Approach 1:
The ventilation duct and heat dissipation fan are extracted from the image capturing device and placed in a separate attachable electronic device. This allows the image capturing device to be cooled without incorporating the bulky ventilation infrastructure inside it, thus maintaining compact size while achieving effective heat dissipation when needed.
Solution Approach 2:
The heat dissipation system is segmented into two independent parts: the image capturing device and the attachable electronic device containing the ventilation duct and fan. This segmentation allows each component to be optimized independently - the image capturing device remains compact while the attachable device provides comprehensive cooling when connected.
2Productivity
If processing power is increased to handle complicated operations, then productivity is improved, but heat generation increases
Solution Approach 1:
The system converts the harmful heat generated by high-performance processing into a manageable byproduct by providing an external heat dissipation pathway. The attachable electronic device with its ventilation duct and fan actively removes the heat generated during high-performance operations, allowing the image capturing device to maintain high processing power without suffering from overheating limitations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution efficiently reduces temperature increases in image capturing devices, preventing component damage and allowing for extended operation without restrictions, thus enhancing convenience and performance while maintaining a compact device size.
Implementation Method 1
An external electronic device with a heat transfer unit, such as a Peltier element
Implementation Method 2
a heat dissipation unit, including a heat dissipation fin and fan
Data Source
AI summary
An electronic device includes an interface unit including a connection portion attachable to an external device by being connected with an interface terminal disposed in the external device, a heat transfer unit, and a heat dissipation unit, wherein the heat transfer unit and the heat dissipation unit are connected with the interface unit, and are in a direction opposite the external device when the interface unit is connected with the external device.