3D Structural Electronics via Extrusion and CNC Machining
Solution Overview
Problem
Conventional manufacturing methods for 3D structural electronics face challenges such as insufficient mechanical and thermal properties, impact resistance, and contamination issues with liquid resins in stereolithography, which limit the reliability and functionality of electronic components.
Innovation Solution
An extrusion-based additive manufacturing system integrating fused deposition modeling (FDM), pick and place technology, and CNC machining to create multi-material, heterogeneous structures with non-conventional component placement, using a thermoplastic substrate and subtractive manufacturing methods for high-resolution features, eliminating the need for housing and addressing contamination issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If stereolithography is used to manufacture 3D structural electronics, then complex 3D structures can be created, but contamination issues arise from liquid resins and mechanical/thermal properties are insufficient
Solution Approach 1:
The patent changes the material state parameter from liquid resin (stereolithography) to thermoplastic material (FDM). This parameter change resolves the contradiction by providing both the ability to create complex 3D structures through additive manufacturing and sufficient mechanical/thermal properties inherent to thermoplastic materials, eliminating contamination issues while maintaining structural complexity capabilities
Solution Approach 2:
The patent employs multi-material FDM printing to create composite structures that combine thermoplastic substrates with embedded electronic components and conductive materials. This composite approach allows the structure to achieve both complex 3D geometry and enhanced mechanical/thermal properties through material composition rather than relying on单一 liquid resin
2Ease of manufacture
If conventional manufacturing methods are used for 3D structural electronics, then production processes are simple, but impact resistance and reliability are limited
Solution Approach 1:
The patent merges multiple manufacturing processes (FDM additive manufacturing, CNC subtractive manufacturing, pick-and-place component assembly) into an integrated hybrid system. This combination allows the creation of structures with enhanced impact resistance through multi-material layering and complex geometries while maintaining manufacturing efficiency through automation and process integration
Solution Approach 2:
The patent transitions from conventional 2D/planar electronics manufacturing to true 3D structural electronics with components embedded in three-dimensional space. This dimensional change enables impact resistance through distributed component placement and energy-absorbing 3D structures while maintaining ease of manufacture through automated multi-axis positioning and robotic assembly
3Adaptability or versatility
If multi-material heterogeneous structures are created with non-conventional component placement, then functionality and design complexity are enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent creates a universal hybrid manufacturing system that integrates FDM printing, CNC machining, and robotic pick-and-place capabilities into a single multi-functional platform. This universal system can handle multiple materials (thermoplastics, conductive materials, electronic components) and perform diverse operations (deposition, machining, assembly) thereby enabling non-conventional component placement and multi-material structures while managing manufacturing complexity through system integration rather than separate processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables the production of 3D structural electronics with enhanced mechanical and electrical properties, impact resistance, and reduced manufacturing costs, allowing for complex designs and strategic placement of sensors, suitable for applications in electronics, UAVs, and biomedical industries.
Implementation Method 1
an extrusion-based additive manufacturing system for 3D structural electronics that utilizes fused deposition modeling (FDM)
Implementation Method 2
A first machine that fills the interconnection cavities with a conductive material
Data Source
AI summary
The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.