Failure Prognostic Package With Segmented Weaker Trace
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Solution Overview
Problem
Users often experience abrupt hardware failures in electronic devices like cell phones and laptops without prior notification, leading to data loss and inconvenience, as there is no advanced warning for hardware failures unlike battery depletion.
Innovation Solution
A failure prognostic package is designed with a substrate having a prognostic trace that is weaker than the electronic component trace, providing advanced notice of failure through visual or audible indications, allowing users to take preventive measures before the device becomes unavailable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a prognostic trace is made weaker than the electronic component trace to provide early failure warning, then the ability to detect impending failure is improved, but the structural integrity and reliability of the package is worsened
Solution Approach 1:
The package is segmented into two distinct trace systems: electronic component traces that maintain full strength for functional operation, and prognostic traces that are intentionally weakened to serve as failure indicators. This segmentation allows the weaker prognostic trace to fail first and provide warning without compromising the overall package integrity, as the electronic component traces remain intact and functional until the actual package failure occurs.
2Loss of time
If the prognostic trace is made weaker to fail first and provide warning, then the loss of time for user response is reduced, but the device complexity increases due to the additional trace structure
Solution Approach 1:
The prognostic trace structure is merged with the existing electronic component trace layout on the substrate. Both trace types follow similar routing paths and are integrated into the same package structure, minimizing additional complexity. The prognostic trace is electrically isolated but structurally integrated, allowing it to provide failure warning functionality without requiring a completely separate monitoring system or additional complex components.
Data Source
AI summary
In accordance with one embodiment, a failure prognostic package includes a substrate having a first surface and an opposite second surface. An electronic component trace is coupled to the first surface. An electronic component is electrically coupled to the electronic component trace. A prognostic trace is coupled to the first surface of the substrate and is electrically isolated from the electronic component. A failure zone of the failure prognostic package includes a plurality of sides and a plurality of corners, wherein the prognostic trace is weaker at the failure zone than the electronic component trace. Failure of the prognostic trace does not cause failure of the failure prognostic package. However, failure of the prognostic trace provides advanced notice of failure of the failure prognostic package.