Unified Fan Duct and Controller Housing for Aircraft Cooling
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Solution Overview
Problem
Conventional fan motor controller assemblies are bulky and costly due to the use of heavy thermal interfaces and separate finned heat exchangers, which hinder the increase of packing density and efficient heat dissipation in electronic components, particularly in aircraft applications.
Innovation Solution
A compact electronics cooling system where the fan duct and housing form a unified structure with a tubular fan duct containing a fan with rotor blades and stator vanes, allowing direct mounting of electronic components on the fan duct casing, utilizing the pressure differential to create a cooling airflow path through inlet and bleed holes for efficient heat dissipation without additional weight or cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional box-like fan motor controller housing with flat base and machined fins are used, then heat dissipation surface area is increased, but cost and weight of the total assembly increase
Solution Approach 1:
The housing is designed as a unified tubular structure that integrates both the fan duct and motor controller housing into a single piece, eliminating the need for separate thermal interfaces and machined fins. This merging of functions reduces the number of parts and overall weight while maintaining heat dissipation capability through the tubular geometry itself
Solution Approach 2:
The tubular housing structure serves multiple functions simultaneously: it acts as the fan duct, the motor controller housing, and the heat dissipation structure. This multi-functionality eliminates the need for separate cooling components, reducing weight and cost while improving packing density
2Stability of the object's composition
If conventional box-like fan motor controller housing with flat base is used, then mounting stability is provided, but cost and weight of the total assembly increase
Solution Approach 1:
The flat base is integrated directly into the tubular housing structure as a single-piece construction, eliminating the need for separate thermal interfaces. This integration maintains mounting stability while removing unnecessary components that add weight and cost
3Volume of moving object
If packing density of heat generating electronics is increased, then spatial footprint is reduced, but heat dissipation capability must be improved to avoid excessive component degradation
Solution Approach 1:
The tubular housing provides three-dimensional heat dissipation pathways around the electronics, utilizing the cylindrical geometry to distribute heat in multiple directions. This allows dense electronics packaging while maintaining effective heat dissipation through the tubular structure's surface area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency while reducing the overall mass and cost of the assembly by eliminating the need for heavy thermal interfaces and separate fins, effectively managing heat generation in densely packed electronic components.
Implementation Method 1
A cooling airflow path extends from a high-pressure region of the tubular fan duct, through an inlet hole into the interior space, and out a bleed hole into a surrounding environment
Implementation Method 2
The electronics housing is mounted directly on the tubular fan duct, such that the electronics housing and the fan duct casing together enclose an interior space
Data Source
AI summary
An electronics cooling system comprises a tubular fan duct and an electronics housing. The fan duct includes has a fan duct casing containing a fan with rotor blades and stator vanes. The electronics housing is mounted directly on the tubular fan duct, such that the electronics housing and the fan duct casing together enclose an interior space. A cooling airflow path extends from a high-pressure region of the tubular fan duct, through an inlet hole into the interior space, and out a bleed hole into a surrounding environment. The electronics cooling system further comprises three electronics mounts within the interior space. A first electronics mount is located immediately adjacent to the inlet hole, on the fan duct. A second electronics mount is located immediately radially outward of the stator vanes, on the fan duct. A third electronics mount is located immediately adjacent to the bleed hole, on the housing.