Method of manufacture of fan-out type semiconductor package

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Solution Overview

Problem

Existing fan-out type semiconductor packages face challenges in achieving structural reliability due to interference between proximate connection terminals, which can be exacerbated by the increasing number of connection terminals in contemporary and emerging semiconductor packages.

Innovation Solution

A method of manufacturing fan-out type semiconductor packages involves forming a first wiring structure, connecting a semiconductor chip, applying a lower encapsulant that covers the chip's lateral surface but not the upper surface, followed by an upper encapsulant with a different composition, and creating a second wiring structure on the upper encapsulant with smaller filler diameter or lower filler proportion, enhancing structural reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a fan-out design is adopted to increase the number of connection terminals, then the data storage and computational capabilities are improved, but the interference between proximate connection terminals increases

Engineering Contradiction:

Improvenumber of connection terminalsVSAvoidinterference between connection terminals

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The encapsulant is divided into two distinct segments: a lower encapsulant with first filler particles and an upper encapsulant with second filler particles. This segmentation allows different regions of the package to have optimized properties for their specific functions, with the lower encapsulant providing structural support and the upper encapsulant providing terminal protection and spacing

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different filler particles are used in different regions of the encapsulant. The lower encapsulant contains first filler particles with specific properties, while the upper encapsulant contains second filler particles with different properties. This local quality optimization reduces interference between proximate connection terminals by providing appropriate material characteristics in each region

Inventive Principle:

Principle #3Local quality

2Length of moving object

If the overall thickness of the semiconductor package is reduced, then the physical size is decreased, but the structural reliability may be compromised

Engineering Contradiction:

Improveoverall thicknessVSAvoidstructural reliability

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The encapsulant is constructed as a composite structure with two different materials: a lower encapsulant material containing first filler particles and an upper encapsulant material containing second filler particles. This composite approach maintains structural reliability by combining materials with complementary properties while enabling reduced overall thickness through optimized material selection and arrangement

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS20260076251A1Method of manufacture of fan-out type semiconductor package

Publication Date: 2026.03.12 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of manufacture for a semiconductor package includes; forming a first wiring structure, connecting a semiconductor chip to the first wiring structure, forming a lower encapsulant on the first wiring structure to cover at least a portion of a lateral surface of the semiconductor chip, wherein the lower encapsulant does not cover an upper surface of the semiconductor chip, forming an upper encapsulant on the lower encapsulant, wherein the upper encapsulant covers the upper surface of the semiconductor chip and the upper encapsulant has a materially different composition than the lower encapsulant, and forming a second wiring structure on the upper encapsulant.