Integrated Fan-Out Package Thermal Management via Heat Dissipation Layer
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Solution Overview
Problem
The semiconductor industry faces challenges in heat dissipation for compact electronic packages, such as integrated fan-out packages, where efficient heat removal is hindered by the miniaturization of components and increased integration density.
Innovation Solution
The implementation of a heat dissipation strategy involving a heat dissipation layer, thermal vias, thermal bumps, and a redistribution layer structure around hot spots within the package, which includes a heat dissipation layer covering a significant portion of the semiconductor chip's surface, thermally connected through integrated fan-out vias and bumps to facilitate effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If integrated fan-out packages are miniaturized to occupy less area, then package compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent extends heat dissipation pathways from the chip surface into the vertical dimension by forming through-substrate vias that penetrate the substrate thickness. This allows heat to be conducted from the active surface through the substrate to the bottom surface, effectively utilizing the third dimension (depth) to increase heat dissipation area without increasing the package footprint area.
Solution Approach 2:
The patent divides the heat dissipation function into multiple segments: heat dissipation regions on the chip surface, through-substrate vias penetrating the substrate, and heat dissipation regions on the bottom surface. This segmentation allows heat to be distributed and conducted through multiple separate pathways rather than relying on a single heat dissipation structure, improving overall thermal management in compact packages.
2Productivity
If integration density is increased to improve productivity, then more components are integrated, but heat dissipation becomes more difficult
Solution Approach 1:
The patent creates localized heat dissipation regions that are spatially correlated with the high-density component integration areas. By forming heat dissipation regions and through-substrate vias at specific locations beneath and adjacent to densely integrated components, the patent provides targeted thermal management exactly where heat generation is highest, enabling higher overall integration density without compromising heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances heat dissipation efficiency, reduces operation temperatures, and eliminates hot spots, thereby improving package performance.
Implementation Method 1
a heat dissipation layer, and the heat dissipation layer covers at least 30 percent of a first surface of the first semiconductor chip
Implementation Method 2
The redistribution layer structure is at a first side of the first semiconductor chip and thermally connected to the heat dissipation layer of the first semiconductor chip
Data Source
AI summary
An integrated fan-out package includes a first semiconductor chip, a plurality of through integrated fan-out vias, an encapsulation layer and a redistribution layer structure. The first semiconductor chip includes a heat dissipation layer, and the heat dissipation layer covers at least 30 percent of a first surface of the first semiconductor chip. The through integrated fan-out vias are aside the first semiconductor chip. The encapsulation layer encapsulates the through integrated fan-out vias. The redistribution layer structure is at a first side of the first semiconductor chip and thermally connected to the heat dissipation layer of the first semiconductor chip.