Semiconductor/Solid-State Device Testing/Measurement TRIZ Cases

A probe bonding device uses a vision system to capture multiple images while adjusting height for accurate position detection.

A transfer mold uses shape-matched cavities to position Micro LED chips via vibration and tilting.

Parallel heat storage tanks and variable valves adjust fluid flow distribution, resolving unstable temperature controllability in semiconductor manufacturing.

Offset penetration holes in movable guide plates hold optical probes, reducing alignment time and complexity during inspection.

Fluid bearings and segmented actuators maintain a 0.1-2 mm gap between the injector and substrate, resolving precision loss as chamber size increases.

A semiconductor test structure positions electrodes over a dielectric region void of metal to enable high voltage testing.

A UV sensor calibration method uses periodic shutter control to equalize illumination intensity between sensors.

Laser irradiation creates internal modified regions in wafers, with imaging units detecting transmitted light to derive precise wafer thickness.

Normal incidence interferometry with close-proximity reference plates eliminates vibration sensitivity and thermal drift in semiconductor shape measurements.

Adjusting LED die depression depth into a single fluorescent sheet controls color emission without multiple sheets.

A measurement model estimates process parameter values from wafer structure measurements using regression-based optimization.

A substrate with a PN junction diode enables electrical testing of through silicon vias before dicing to detect defects.

Calculates offset values from pre- and post-fabrication alignment mark measurements to correct stress-induced shifts in semiconductor lithography.