Temperature Control System for Semiconductor Devices
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Solution Overview
Problem
Existing temperature control systems for semiconductor manufacturing devices face challenges in maintaining stable temperature controllability due to limitations in heat storage volume and responsiveness, particularly when using fluid-based systems where fluid storage tanks struggle to consistently retain pre-set temperatures.
Innovation Solution
A temperature control system is designed with multiple heat storage tanks and circulation pumps arranged in parallel, forming a circulation path that merges fluids from low-temperature and high-temperature flow paths with a bypass flow, allowing for adjustable flow rate distribution using variable valves to ensure stable temperature control without relying on heaters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the flow rate of low-temperature fluid in the chiller unit is reduced to improve heating responsiveness, then heating speed improves, but cooling capacity is degraded and temperature controllability is worsened
Solution Approach 1:
The system divides the temperature control function into two independent units: a chiller unit for cooling and a heater unit for heating. Each unit operates independently with its own fluid circulation system, allowing the chiller to maintain constant flow rate for stable cooling while the heater can operate at full capacity for rapid heating without compromising overall temperature controllability.
2Speed
If the capacity of the heater is increased to improve heating speed, then heating responsiveness improves, but high frequency power leak current increases
Solution Approach 1:
The temperature control system is segmented into separate cooling and heating units. The heater unit is designed as an independent component with dedicated high-voltage power supply and control circuitry, isolated from the chiller unit's low-voltage system. This segmentation allows the heater to be optimized for high-power rapid heating while the chiller maintains stable cooling operation, preventing power interference and leak current issues.
Solution Approach 2:
A microprocessor-based control unit acts as an intermediary between the power supply and the heater/chiller units. It manages power distribution, monitors temperature sensors, and controls the operation of both units to achieve stable temperature control while minimizing power leak current through intelligent power management and timing control.
3Reliability
If a heater is embedded within the electrostatic chuck to improve temperature control, then heating capability improves, but high frequency power leaks outside the chamber via heater line
Solution Approach 1:
A matching unit serves as an intermediary between the high-frequency power supply and the electrostatic chuck. This matching unit includes impedance matching circuitry and filtering components that prevent high-frequency power from leaking through the heater line to the chamber, while still enabling effective heating of the electrostatic chuck for temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration secures adequate heat storage volume and enhances temperature control stability, enabling rapid and precise temperature adjustments, improving productivity and yield by maintaining temperature stability and responsiveness.
Implementation Method 1
a circulation path for circulating fluid stored in the heat storage tanks of the temperature control units
Implementation Method 2
a first temperature adjustment unit that stores fluid adjusted to a first temperature; a second temperature adjustment unit that stores fluid adjusted to a second temperature
Implementation Method 3
a temperature adjustment part that is arranged at or near the member and is configured to pass fluid from the combination flow path and cool or heat the member
Data Source
AI summary
A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.