Probe Bonding Device Height Measurement via Multi-Image Vision Feedback
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Solution Overview
Problem
Conventional probe bonding devices face challenges in accurately measuring the height (z-coordinate) of probes during the bonding process, leading to potential errors in positioning and degraded bonding quality.
Innovation Solution
A probe bonding device and method that utilize a controller to capture multiple images while adjusting the height of a vision device, allowing for accurate height measurement and correction of the probe's position by comparing standard and measured heights, ensuring precise alignment and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the probe is forcibly lowered to contact the bonding position, then positioning can be completed, but the probe position accuracy degrades due to height measurement errors
Solution Approach 1:
The patent implements a feedback mechanism where the vision device captures images of the probe at multiple heights, and the system processes these images to calculate the actual height of the probe. This height information is fed back to the control system, which then adjusts the probe's vertical position accordingly. This feedback loop eliminates the need for forced lowering while maintaining accurate positioning, as the system continuously monitors and corrects the probe's position based on real-time vision data.
2Reliability
If the probe does not contact the bonding position, then the probe is protected from damage, but the bonding process cannot be completed
Solution Approach 1:
The patent applies preliminary action by using the vision device to pre-measure and calculate the exact height and position of the probe before the bonding operation. The system determines the precise distance between the probe tip and the bonding position, then adjusts the probe's vertical position in advance to ensure accurate alignment. This preliminary positioning ensures that when the bonding process begins, the probe is already correctly positioned, eliminating the need for forced contact while ensuring bonding completion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate extraction of probe height information and correction of positional differences, resulting in improved bonding precision and quality by maintaining a predetermined interval between the probe and substrate.
Implementation Method 1
a laser unit configured to emit a laser beam to solder the probe to an electrode of the substrate
Implementation Method 2
the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height
Data Source
AI summary
Disclosed is a probe bonding device and method. The probe bonding device includes, a second gripper configured to move the probe to a bonding position on the substrate, a laser unit configured to emit a laser beam, a fourth vision device configured to check whether the probe gripped by the second gripper; and a controller configured to control the second gripper and the fourth vision device, wherein the controller controls the fourth vision device to photograph one end of the probe a plurality of numbers of times while sequentially adjusting a height of at least one of the second gripper and the fourth vision device at a predetermined interval to acquire information on a height of the probe based on a plurality of captured images, thereby bonding the probe to an accurate position to enhance bonding quality of the probe and quality of a probe card.