Micro LED Mass Transfer Mold with Shape-Matched Cavities
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Solution Overview
Problem
Current mass transfer technologies for Micro LEDs are inefficient, requiring multiple stages for transferring red, blue, and green Micro LED chips, resulting in low transfer efficiency and yield due to the need for separate processes for each color.
Innovation Solution
Designing Micro LED chips of different colors with unique shapes and corresponding transfer cavities on a mold, allowing for simultaneous transfer of multiple colors by matching shapes, and using vibration and tilting to ensure accurate placement, with optional vacuum suction for secure positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate transfer processes are used for each color of Micro LED chips, then transfer yield is maintained, but transfer efficiency deteriorates
Solution Approach 1:
The transfer mold is segmented into multiple types of transfer cavities, each with unique shapes corresponding to different colors of Micro LED chips. This allows different colored chips to be transferred simultaneously in a single process, improving transfer efficiency while maintaining yield through shape-specific cavity matching
Solution Approach 2:
Different shapes of transfer cavities are designed for different colored Micro LED chips. The asymmetric shape design ensures that each chip type falls into its corresponding cavity, preventing mixing errors and maintaining high transfer yield while enabling parallel processing of multiple colors
2Loss of time
If multiple stages are used for transferring different colors, then placement accuracy is maintained, but transfer time increases
Solution Approach 1:
Multiple transfer operations for different colored Micro LED chips are merged into a single transfer process. The transfer mold integrates multiple cavity types that can simultaneously receive different chip colors, reducing total transfer time while maintaining placement accuracy through shape-specific cavity design
Solution Approach 2:
The transfer mold is pre-configured with multiple types of transfer cavities in specific positions before the transfer process begins. This preliminary arrangement allows all necessary cavities to be ready simultaneously, enabling parallel transfer of multiple chip colors in one operation without compromising placement precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves transfer efficiency while maintaining high yield by ensuring each color chip falls into its specific cavity, allowing for the simultaneous transfer of multiple colors in a single process, reducing production time and increasing efficiency.
Implementation Method 1
vibrating the transfer mold to cause the first and second Micro LED chips to fall into shape-matched first and second type transfer cavities
Implementation Method 2
tilting the transfer mold so that the Micro LED chips that have not fallen into the first and second type transfer cavities leave the transfer surface
Data Source
AI summary
The present disclosure provides a method and an apparatus for mass transfer of Micro LEDs. In one embodiment, the method comprises: providing Micro LED chips; dumping at one time Micro LED chips onto a transfer surface of a transfer mold, the transfer surface being formed with transfer cavities; and vibrating the transfer mold to cause the Micro LED chips to fall into shape-matched transfer cavities respectively, and tilting the transfer mold so that the Micro LED chips that have not fallen into the transfer cavities leave the transfer surface.