Fan-Out Package Via Interface for Delamination-Resistant Adhesion
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving compactness and efficient integration of electronic components, particularly in integrated fan-out packages, due to issues with adhesion and stability of materials used in the packaging process.
Innovation Solution
The use of an adhesion promoter material layer, formed through a chelating reaction between a chelating agent and the metal surfaces of through integrated fan-out vias (TIVs), enhances the adhesion and stability of the packaging structure by forming a metal chelate compound that reacts selectively with the TIVs, thereby improving the bonding between the die and the encapsulant material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging structures are used without adhesion promoter layers, then the manufacturing process is simpler, but the adhesion between TIVs and encapsulants is unreliable leading to delamination
Solution Approach 1:
An adhesion promoter layer comprising a metal chelate compound is introduced as an intermediary between the TIVs and the encapsulant. This intermediate layer forms coordination bonds with the metal in the TIVs and provides reliable adhesion to the encapsulant, preventing delamination without significantly complicating the overall packaging structure.
Solution Approach 2:
The adhesion promoter layer uses a composite material system where a metal chelate compound (formed by reaction between a metal layer and a chelating agent) provides both adhesion promotion and oxidation protection. This composite approach enhances the interface between TIVs and encapsulant while maintaining structural integrity.
2Reliability
If TIVs are directly exposed to the environment, then the manufacturing process is simpler, but oxidation occurs leading to reduced reliability
Solution Approach 1:
The adhesion promoter layer acts as a protective intermediary between the metal TIVs and the external environment. This layer prevents direct exposure of the metal to oxidizing conditions while simultaneously providing adhesion to the encapsulant, thus serving dual functions of protection and bonding.
Solution Approach 2:
The metal chelate compound in the adhesion promoter layer creates a chemically stable and inert environment at the TIV interface, preventing oxidation reactions by isolating the reactive metal surfaces from environmental oxygen and moisture.
3Stability of the object's composition
If adhesion promoter layers are added to improve adhesion, then the interface stability improves, but the manufacturing process becomes more complex
Solution Approach 1:
The adhesion promoter layer is formed through a preliminary chemical reaction between a metal layer and a chelating agent applied to the TIVs before encapsulant bonding. This preliminary action creates a stable coordination bond structure in advance, ensuring reliable adhesion and interface stability before the final encapsulant attachment.
Solution Approach 2:
The mechanical adhesion problem is replaced by a chemical solution where coordination bonds (chemical bonds) are formed between the metal chelate compound and the TIVs. This chemical bonding mechanism provides superior and more stable adhesion compared to traditional mechanical bonding methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the adhesion and stability of the packaging structure, allowing for more compact and efficient integration of semiconductor components, enhancing the reliability and performance of integrated fan-out packages.
Implementation Method 1
A method involving the formation of an adhesion promoter layer using a metal chelate compound on the TIVs, which reacts with a chelating agent to form coordination bonds
Implementation Method 2
improving adhesion between the TIVs and the encapsulant while preventing oxidation by creating a protective barrier
Data Source
AI summary
A package structure and method of forming the same are provided. The package structure includes a die, a through via, an encapsulant, an adhesion promoter layer, an insulating layer and a polymer layer. The through via is laterally aside the die. The encapsulant laterally encapsulates the die and the a through via. The adhesion promoter layer and an insulating layer are sandwiched between the a through via and the encapsulant. Sidewalls of the a through via are covered by the adhesion promoter layer and the insulating layer. The polymer layer is located under the through via and encapsulant. The insulating layer includes a plurality of portions.