Fan-Out Semiconductor Module Layout for Wire Isolation and Cooling
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Solution Overview
Problem
Existing semiconductor modules face issues with short-circuits due to contact between wires and heat sinks, which hinder thickness reduction and heat dissipation, and insulating properties are compromised by steps between semiconductor elements and sealing materials.
Innovation Solution
A semiconductor device with a fan-out package structure is designed, featuring a semiconductor element covered by an insulating resin material and extension wires connected to electrode pads, eliminating steps between the semiconductor element and the sealing material to enhance insulation and incorporating double-sided heat dissipation without heat dissipation blocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are used to connect semiconductor devices to lead terminals, then electrical connection is achieved, but short-circuits occur due to contact between wires and heat sinks
Solution Approach 1:
The patent removes the wire component from the system by implementing direct bonding between the semiconductor device and lead terminal. The extension wire structure is eliminated in favor of direct metallurgical bonding, extracting the harmful wire element that caused short-circuit issues while maintaining electrical connectivity through alternative bonding methods
Solution Approach 2:
The patent introduces a redistribution layer as an intermediary structure between the semiconductor device and lead terminal. This redistribution layer serves as a mediator that provides both electrical connection and physical separation from heat sinks, eliminating the short-circuit risk while maintaining reliable electrical connectivity
2Reliability
If heat dissipation blocks are used to prevent short-circuits, then insulation is improved, but device thickness increases and heat dissipation is hindered
Solution Approach 1:
The patent removes the heat dissipation block component from the system by implementing direct bonding structures that provide both electrical connection and insulation functions. The separate heat dissipation block is extracted and replaced by integrated bonding structures that eliminate the need for additional insulating components
Solution Approach 2:
The bonding structures in the patent serve multiple functions simultaneously: they provide electrical connection, mechanical support, and thermal management. The direct bonding interface integrates these functions into a single structure, eliminating the need for separate heat dissipation blocks and reducing overall device thickness
3Ease of manufacture
If steps are formed between semiconductor elements and sealing materials, then packaging is simplified, but insulating properties are compromised
Solution Approach 1:
The patent applies different surface quality requirements to different regions: the bonding surfaces are prepared with high precision and flatness to eliminate steps, while other packaging regions maintain simpler structures. This localized quality control ensures insulation reliability at critical bonding interfaces without complicating the overall packaging process
Data Source
AI summary
A semiconductor device includes a semiconductor element, a sealing material, and an extension wire. The semiconductor element has, on a front surface, a first electrode pad and at least one second electrode pad, and generates a current in a direction connecting the front surface and a back surface. The sealing material is made of an insulating resin material and covers a part of the front surface and a side surface of the semiconductor element. The extension wire is disposed above the semiconductor element and inside the sealing material or on the sealing material. The extension wire is electrically connected to the second electrode pad, and extends from a position inside of a contour of the semiconductor element to a position outside of the contour of the semiconductor element.