Fan-Out Semiconductor Packaging With Cured Adhesive Fixation

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Solution Overview

Problem

Existing fan-out package manufacturing methods for semiconductor devices face issues with semiconductor element displacement during encapsulation due to the temporary fixing of elements by adhesive layers, leading to potential misalignment and manufacturing challenges.

Innovation Solution

A method involving the use of a curable bonding adhesive layer to fix semiconductor elements to a support member, followed by encapsulation and carrier removal, ensuring strong adhesive strength and precise positioning, with laser-assisted carrier peeling to maintain integrity and reduce displacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a temporary adhesive layer is used to attach semiconductor elements to the carrier, then the elements can be initially positioned, but the elements may displace during encapsulation due to insufficient bonding strength

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The adhesive layer transitions from a temporary state with lower bonding strength to a permanent state with high bonding strength through curing. The chemical composition and physical properties of the adhesive change during curing, transforming it from a positioning aid to a rigid bonding medium that prevents displacement during encapsulation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesive layer is applied in advance to the carrier before semiconductor elements are attached. This preliminary application allows for initial positioning of elements, and subsequent curing locks them in place, preventing displacement during later encapsulation processes.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If the adhesive layer is made stronger to prevent displacement, then element positioning is improved, but the adhesive layer may peel from the encapsulant material

Engineering Contradiction:

Improveelement positioning stabilityVSAvoidbonding strength between adhesive and encapsulant

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The adhesive composition is formulated with specific parameters including bonding strength to semiconductor elements (4.0-20 MPa), bonding strength to encapsulant material (4.0-20 MPa), and glass transition temperature (-40°C to 40°C). These parameter optimizations ensure balanced bonding performance without peeling issues.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesive layer is formulated as a composite material containing thermoplastic resin, curing agent, and filler particles. This composite structure provides both strong initial bonding for element attachment and maintained bonding strength after curing to prevent peeling from the encapsulant material.

Inventive Principle:

Principle #40Composite materials

3Reliability

If a rigid adhesive is used to fix semiconductor elements, then displacement is prevented, but the adhesive layer cannot function as part of the final product

Engineering Contradiction:

Improveelement fixationVSAvoidadhesive layer functionality in final product

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The adhesive layer serves multiple functions: initial temporary bonding for element positioning, permanent rigid fixation after curing to prevent displacement, and structural component of the final encapsulated device. The same layer performs all these functions without requiring removal or replacement.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The adhesive layer transforms itself through curing from a soft positioning medium to a rigid structural component. This self-transformation allows the same material to provide both initial ease of handling and final structural integrity without external intervention.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces semiconductor element displacement, enhances manufacturing efficiency, and allows for the formation of fine re-distribution layers with improved flatness and accuracy, while minimizing heat damage and simplifying the manufacturing process.

Implementation Method 1

fixing the plurality of semiconductor elements to the support member by curing the curable bonding adhesive layer

Methodology Applied

Scientific EffectCuring:

Implementation Method 2

encapsulating the plurality of semiconductor elements with an encapsulant material

Methodology Applied

Scientific EffectEncapsulation:

Data Source

PatentUS12604756B2Method for manufacturing semiconductor device

Publication Date: 2026.04.14 RESONAC CORP

AI summary

A method for manufacturing a semiconductor device includes preparing a plurality of semiconductor elements each including a first surface on which a connection terminal is formed and a second surface on a side opposite to the first surface, preparing a support member in which a curable bonding adhesive layer is formed on a carrier, attaching the plurality of semiconductor elements to the support member such that the second surface of each of the plurality of semiconductor elements is directed toward the curable bonding adhesive layer, fixing the plurality of semiconductor elements to the support member by curing the curable bonding adhesive layer, encapsulating the plurality of semiconductor elements with an encapsulant material, and removing the carrier.