Fan-Out Semiconductor Package Module with Embedded Components
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Solution Overview
Problem
The increasing size of mobile device displays requires larger battery capacities, leading to reduced available mounting area on printed circuit boards, which in turn necessitates smaller semiconductor package sizes, resulting in high electromagnetic interference (EMI) and difficulty in directly mounting semiconductor chips due to large distances between components.
Innovation Solution
A fan-out semiconductor package module is developed, where a semiconductor chip and multiple passive components are embedded in a single package with a core member having through-holes, encapsulants, and a redistribution layer, reducing the mounting area and electrical path length between components, and using a reinforcing member to control resin flow and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If COB mounting technology is used to mount individual passive elements and semiconductor package on a printed circuit board, then price advantage is achieved, but mounting area is large and electromagnetic interference between components is high
Solution Approach 1:
The patent merges the semiconductor chip and passive components into a single integrated package module, eliminating the need for separate mounting on the printed circuit board. This consolidation reduces the total mounting area while maintaining manufacturing simplicity, directly resolving the contradiction between price advantage and large mounting area.
Solution Approach 2:
The patent embeds passive components within the package structure of the semiconductor chip, creating a nested configuration where components are housed within each other's spatial envelope. This nesting approach minimizes the overall footprint and mounting area while keeping the manufacturing process straightforward.
2Ease of manufacture
If COB mounting technology is used to mount individual passive elements and semiconductor package on a printed circuit board, then price advantage is achieved, but electromagnetic interference between components is high
Solution Approach 1:
By combining the semiconductor chip and passive components into a single package module, the patent reduces the physical distance between components. This proximity reduces the length of electrical paths and minimizes electromagnetic interference, while the integrated manufacturing process maintains cost-effectiveness.
Solution Approach 2:
The patent introduces an encapsulant as an intermediary material that fills the space between the semiconductor chip and passive components. This encapsulant acts as a shielding medium that reduces electromagnetic interference while allowing the components to remain in close proximity for cost-effective manufacturing.
3Area of stationary object
If the distance between the semiconductor chip and the passive components is large, then mounting area is available, but electric noise increases
Solution Approach 1:
The patent merges the semiconductor chip and passive components into a single integrated package, reducing the distance between them. This close integration minimizes electric noise by shortening the electrical paths, while the overall package size remains compact to conserve mounting area on the printed circuit board.
4Area of stationary object
If multiple components are embedded in a single package, then mounting area is reduced, but resin flow control and warpage become difficult
Solution Approach 1:
The patent segments the encapsulation process into multiple stages, allowing different regions of the package to be filled and cured sequentially. This segmentation enables precise control of resin flow in complex multi-component packages, reducing manufacturing difficulty while maintaining compact mounting area.
Solution Approach 2:
The patent performs preliminary positioning and partial encapsulation of components before final resin filling. This preliminary action allows for better control of resin flow patterns and reduces warpage by pre-establishing the structural framework, making the manufacturing process easier despite the reduced mounting area.
5Area of stationary object
If multiple components are embedded in a single package, then mounting area is reduced, but warpage control becomes difficult
Solution Approach 1:
The patent segments the package structure into multiple layers and regions with different material compositions and thicknesses. This segmentation allows for differential expansion and contraction, compensating for warpage forces while maintaining a compact overall size that reduces mounting area.
Solution Approach 2:
The patent uses composite materials with different thermal and mechanical properties in various regions of the package. These composite structures provide warpage compensation by balancing internal stresses, enabling compact multi-component integration without sacrificing structural stability.
Data Source
AI summary
A fan-out semiconductor package module includes a core member having first and second through-holes. A semiconductor chip is in the first through-hole and has an active surface with a connection pad and an inactive surface opposing the active surface. Another passive component is in the second through-hole. An first encapsulant covers at least portions of the core member and the passive component, and fills at least a portion of the second through-hole. A reinforcing member is on the first encapsulant. A second encapsulant covers at least a portion of the semiconductor chip, and fills at least a portion of the first through-hole. A connection member is on the core member, the active surface of the semiconductor chip, and the passive component, and includes a redistribution layer electrically connected to the connection pad and the passive component.