Fan-Out Package I/O Redistribution for Mounting and Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing fan-in electronic component packages face challenges in miniaturization and spatial limitations due to the need for all I/O terminals to be disposed inside the semiconductor chip, making it difficult to mount on electronic device mainboards, especially for devices requiring multiple I/O terminals or miniaturized chips.
Innovation Solution
The fan-out electronic component package redistributes I/O terminals outwardly through a connection member, allowing for direct mounting on the mainboard without a separate BGA substrate, utilizing a core member with wiring layers and vias to connect the semiconductor chips and encapsulants, and incorporating redistribution layers and underbump metal layers for secure connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If all I/O terminals are disposed inside the semiconductor chip (fan-in package), then the chip can be miniaturized, but it becomes difficult to mount on electronic device mainboards due to spatial limitations
Solution Approach 1:
The patent transitions from a fan-in package (all I/O terminals inside the chip) to a fan-out package (I/O terminals redistributed outside the chip) by changing the spatial dimension of terminal arrangement. The connection member redistributes I/O terminals outwardly from the chip, allowing direct mounting on mainboards while maintaining miniaturized chip dimensions. This dimensional change resolves the contradiction between chip size reduction and mounting ease.
2Reliability
If separate filters for each band are used in the front end module, then signal filtering performance is achieved, but the size of the front end module increases
Solution Approach 1:
The patent integrates multiple filter functions into a single semiconductor chip structure. The chip includes first and second filters with different frequency characteristics (first band-pass filter for GSM, second band-pass filter for LTE) that are combined in one package. This merging of multiple filtering functions into one component achieves the required signal filtering performance while reducing the overall front end module size.
3Loss of energy
If connection distances are shortened in the package structure, then signal loss is reduced, but the structural complexity increases
Solution Approach 1:
The patent introduces a connection member as an intermediary component that redistributes I/O terminals outwardly from the chip. This connection member includes wiring layers and vias that provide short, direct electrical paths between the chip and external connections. The intermediary structure reduces signal loss by minimizing connection distances while managing the complexity through a standardized package architecture.
Data Source
AI summary
A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.