Fanout Package Structure With Optical I/O for Data Rate Bottlenecks
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Solution Overview
Problem
As the minimum feature size in integrated circuit dies decreases, electrical input/output (I/O) interconnects become a bottleneck in data transmission rate, necessitating enhanced performance and miniaturization of package structures, which existing technologies fail to address effectively.
Innovation Solution
The implementation of fanout technology and optical I/O interconnects, involving a carrier substrate with a de-bonding layer, redistribution circuit layers, and optical windows, allows for the integration of electric and photoelectric integrated circuit dies, enabling miniaturization and efficient data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional electrical I/O interconnects are used, then package structure is simpler, but data transmission rate becomes a bottleneck
Solution Approach 1:
The patent replaces traditional electrical I/O interconnects with optical I/O interconnects. Specifically, optical components (light sources, waveguides, photodetectors) are integrated into the package structure to enable optical signal transmission between semiconductor dies, substituting the electrical transmission mechanism with optical transmission to overcome the data transmission rate bottleneck
Solution Approach 2:
The patent integrates multiple functional components within a nested package structure. Semiconductor dies are mounted on a carrier substrate with optical components embedded within the package layers. The optical waveguides are routed through the package structure, and redistribution circuit layers are embedded between functional layers, creating a nested arrangement where components are housed within each other to achieve miniaturization while supporting optical I/O
2Quantity of substance
If minimum feature size is reduced to increase integration density, then more components can be integrated, but electrical I/O interconnect performance deteriorates
Solution Approach 1:
The patent substitutes electrical transmission with optical transmission to overcome the limitations imposed by reduced minimum feature size. Optical signals can maintain high transmission rates even as electrical interconnect dimensions shrink, allowing continued integration density improvement without sacrificing data transmission performance
Solution Approach 2:
The patent transitions from two-dimensional electrical interconnect scaling to three-dimensional optical interconnect architecture. Optical waveguides are routed through multiple layers and dimensions within the package, allowing data transmission paths that are not constrained by planar feature size reduction, thereby maintaining high transmission rates while achieving greater integration density
3Volume of moving object
If package size is reduced for miniaturization, then device footprint decreases, but thermal management and signal integrity become more difficult
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission to improve signal integrity in miniaturized packages. Optical signals are less susceptible to interference, crosstalk, and signal degradation that plague electrical interconnects in small-scale packages, thereby maintaining reliable data transmission even as package dimensions are reduced
Solution Approach 2:
The patent introduces optical waveguides as intermediary structures that facilitate signal transmission through the compact package. These waveguides act as dedicated transmission channels that guide optical signals from source to detector with minimal interference, preserving signal integrity in the miniaturized package environment where direct electrical connections would be problematic
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances data transmission rate, reduces package size, and lowers transmission costs by effectively addressing the limitations of traditional I/O interconnects.
Implementation Method 1
The electro-optical circuit board includes an optical waveguide. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.
Implementation Method 2
a first photoelectric integrated circuit die optically coupled to the optical waveguide
Data Source
AI summary
In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.