Circuit Optical Details TRIZ Cases
- Phosphor Substrate Layout for LED Color Tuning and Glare Reduction
A phosphor layer arranged around LED electrode bonds shifts emission color while reducing glare, chromaticity variation, and light loss.
- Substrate Adhesive Mounting Structure for Vibration-Resistant Housings
Diagonal housing contact surfaces spread vibration and impact loads across adhesive joints to reduce substrate peeling in compact electronics.
- Transparent Wiring Board Mesh Layout for Less Visible Antennas
Electrically independent dummy mesh lines hide antenna wiring on a transparent substrate without degrading radio transmission.
- Vertical Photonics Chiplet Assembly for Reliable Fiber Coupling
A vertical photonics chiplet uses substrate openings, conductive vias, and top-side fiber arrays to improve coupling reliability and bandwidth.
- Vehicle Light Unit With Conductive Diffuser for Homogeneous LED Output
A conductive transparent covering diffuses closely spaced LEDs into a uniform vehicle light surface while keeping LED cost, intensity, and reliability.
- Stacked Optoelectronic Package Layout for Shorter Signal Paths
A recessed-and-protruding carrier layout stacks ASIC and optoelectronic devices to cut footprint, shorten electrical paths, and reduce heat buildup.