Vertical Photonics Chiplet Assembly for Reliable Fiber Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current 2.1D and 2.5D packaging technologies face challenges in silicon photonic packaging for optical data communication systems, particularly in achieving reliable and efficient optical fiber coupling to semiconductor chips, which affects the performance and cost-effectiveness of these systems.
Innovation Solution
A vertical integrated photonics chiplet assembly is developed, featuring a package substrate with conductive via structures and optical fiber arrays that optically couple to photonics chips, enabling efficient electrical and optical connections through a redistribution layer and flip-chip technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If 2.1D or 2.5D packaging technology is used for silicon photonic packaging, then integration density is improved, but optical fiber coupling reliability deteriorates
Solution Approach 1:
The patent transitions from planar 2.1D/2.5D packaging to vertical 3D packaging architecture. The photonics chip is mounted vertically on the package substrate with optical coupling devices facing upward, and optical fibers are coupled from the top surface rather than edge-coupled in-plane. This vertical dimension enables better optical alignment and coupling reliability while maintaining high integration density through the z-axis stacking.
Solution Approach 2:
The patent introduces a package substrate as an intermediary platform that provides mechanical support, electrical interconnection through conductive vias, and optical access through top-surface openings. This intermediary structure decouples the optical coupling function from the electrical interconnection function, allowing optimized fiber-to-chip coupling through the substrate openings while maintaining robust electrical connections through the conductive via network.
2Ease of manufacture
If conventional packaging is used, then manufacturing simplicity is maintained, but bandwidth and power efficiency deteriorate
Solution Approach 1:
The patent segments the photonic system into separate functional modules: a photonics chip for optical signal generation/detection, a package substrate for electrical interconnection and mechanical support, and external devices for data processing. This segmentation allows each module to be optimized independently and assembled through standardized processes, achieving high bandwidth through vertical optical coupling while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
The patent replaces conventional electrical interconnection through trace routing with vertical optical coupling through the package substrate. Optical signals transmitted vertically through the substrate provide higher bandwidth and lower power consumption compared to electrical signals, while the conductive via structures provide the necessary electrical connections with reduced parasitic capacitance.
3Ease of manufacture
If horizontal optical coupling is used, then manufacturing is simpler, but parasitic capacitance increases
Solution Approach 1:
The patent changes the optical coupling direction from horizontal (in-plane) to vertical (out-of-plane). Optical fibers are coupled to the top surface of the photonics chip through openings in the package substrate, eliminating the need for long horizontal trace routing. This vertical configuration reduces the area of conductive paths, thereby reducing parasitic capacitance and improving signal integrity.
Solution Approach 2:
The patent extracts the optical coupling function from the plane of the package substrate by creating openings through the substrate to expose the top surface of the photonics chip. This separation allows optical fibers to be coupled vertically without interfering with the electrical interconnection layer, reducing capacitive coupling between optical and electrical paths and minimizing parasitic effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved bandwidth, reduced power consumption, and smaller parasitic capacitance, enhancing the performance and cost-effectiveness of optical data communication systems by enabling efficient vertical optical coupling and electrical connections within the package substrate.
Implementation Method 1
an optical fiber array disposed and secured within the opening, such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices
Implementation Method 2
a plurality of conductive via structures disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device
Data Source
AI summary
A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.