Substrate Adhesive Mounting Structure for Vibration-Resistant Housings
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Solution Overview
Problem
Existing electronic apparatuses using adhesives to fix substrates to housings face challenges with peeling due to vibrations or impacts, especially when the substrates have heavy electronic components, as stress concentrations occur at specific adhesion points, leading to adhesive failure.
Innovation Solution
The electronic apparatus employs a unique adhesive fixation method where the substrate is secured to the housing using diagonal protrusions and corresponding cut-off shapes, distributing stress through shear, compression, and tensile forces across multiple adhesion regions, reducing the likelihood of peeling and allowing for a compact design without enlarging the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws are used to fix the substrate to the housing, then the fixation strength is improved, but the mounting position accuracy deteriorates due to forces applied during tightening
Solution Approach 1:
The patent replaces the mechanical screw fixation system with an adhesive bonding system. The adhesive is applied to convex portions on the housing and bonds the substrate to the housing without requiring tightening forces, thereby maintaining mounting position accuracy while achieving sufficient fixation strength.
Solution Approach 2:
The patent applies adhesive locally at convex portions rather than uniformly across the entire substrate surface. This localized application provides sufficient fixation strength at critical points while avoiding the need for widespread mechanical fastening that would compromise positioning accuracy.
2Manufacturing precision
If adhesive is applied to fix the substrate to the housing, then the mounting position accuracy is maintained, but the reliability deteriorates due to peeling from vibrations or impacts
Solution Approach 1:
The patent divides the adhesive bonding structure into multiple convex portions distributed across the substrate surface. This segmentation creates multiple independent bonding points, so that vibrations or impacts must overcome the combined resistance of all convex portions rather than causing peeling at a single location, thereby improving reliability while maintaining positioning accuracy.
Solution Approach 2:
The patent designs the adhesive structure to inherently resist peeling forces from vibrations and impacts before they occur. The convex portion configuration and adhesive application create a bonding structure that is pre-engineered to withstand dynamic loads, cushioning against the harmful effects of vibrations and impacts.
3Reliability
If the housing is enlarged to accommodate the substrate, then the adhesive fixation reliability is improved, but the device size increases
Solution Approach 1:
The patent concentrates adhesive bonding at specific convex portions rather than requiring large-area contact. This localized bonding approach achieves reliable fixation without needing to enlarge the housing to provide extensive bonding surfaces, thereby maintaining compact device dimensions while ensuring fixation reliability.
Data Source
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AI summary
An electronic apparatus includes a substrate, a housing, and an adhesive. The housing has opposing surfaces respectively opposing side surfaces of a first diagonal portion and second diagonal portion serving as a pair of diagonal portions of the substrate and encloses the substrate. The adhesive is positioned between the side surfaces of the first diagonal portion and the second diagonal portion of the substrate and the opposing surfaces of the housing.