Fan-out Semiconductor Package Rear Redistribution Layer
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Solution Overview
Problem
The existing fan-out semiconductor package technologies face challenges in reducing the yield of semiconductor chips due to the need for forming a rear redistribution layer after the semiconductor chip is provided, leading to increased manufacturing costs and time, as well as difficulties in thinning package-on-package structures.
Innovation Solution
The introduction of a rear redistribution layer before the semiconductor chip is disposed, which is formed separately from the encapsulating process, allowing only good products to incorporate this layer, thereby reducing yield loss and enabling a more efficient manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a rear redistribution layer is formed after the semiconductor chip is provided, then the fan-out semiconductor package can be manufactured, but the yield of semiconductor chips decreases
Solution Approach 1:
The rear redistribution layer is formed in advance on the carrier substrate before the semiconductor chip is mounted. This preliminary action allows the layer to be pre-positioned and prepared, eliminating the need for post-chip formation processes that would otherwise reduce yield.
Solution Approach 2:
The manufacturing process is segmented into independent stages: forming the rear redistribution layer on the carrier substrate separately, then mounting the semiconductor chip, and finally forming the encapsulant. This segmentation allows each component to be optimized independently without compromising overall yield.
2Ease of manufacture
If a rear redistribution layer is formed after the semiconductor chip is provided, then the package structure is complete, but manufacturing time and costs increase
Solution Approach 1:
The rear redistribution layer is formed in advance during the carrier substrate preparation stage, before chip mounting. This eliminates subsequent processing steps and reduces total manufacturing time and associated costs.
3Ease of manufacture
If the package structure is thick, then the rear redistribution layer can be formed, but package-on-package structures cannot be thinned
Solution Approach 1:
The rear redistribution layer is formed on the carrier substrate in a planar dimension before chip mounting, allowing the layer to be integrated without increasing the vertical thickness of the final package. This enables thin package-on-package structures while maintaining the functionality of the rear redistribution layer.
Data Source
AI summary
A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; a second connection member disposed on the first connection member and the active surface of the semiconductor chip; a resin layer disposed on the encapsulant; and a rear redistribution layer embedded in the encapsulant so that one surface thereof is exposed by the encapsulant, wherein the resin layer covers at least portions of the exposed one surface of the rear redistribution layer, and the rear redistribution layer is electrically connected to the redistribution layer of the first connection member through connection members formed in first openings penetrating through the resin layer and the encapsulant.