Fan-Out Package Support Member Composite Structure
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Solution Overview
Problem
Fan-out semiconductor packages face challenges in maintaining rigidity while being miniaturized, leading to warpage issues due to reduced thickness, as traditional rigid materials like glass substrates are prone to breakage when used alone.
Innovation Solution
Incorporating a support member with a mixed layer of a glass plate and insulating layers, which provides excellent rigidity and prevents breakage, allowing for a reduced thickness without compromising structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the fan-out semiconductor package is reduced to achieve miniaturization, then the compact size requirement is satisfied, but the rigidity deteriorates causing warpage problems
Solution Approach 1:
The patent applies composite materials by combining a glass plate with insulating layers to form a support member. This composite structure provides enhanced rigidity and structural stability while maintaining a reduced thickness, thereby resolving the contradiction between miniaturization and rigidity retention in fan-out semiconductor packages.
2Strength
If a glass substrate is used to improve rigidity, then the structural stability is enhanced, but the material becomes prone to breakage
Solution Approach 1:
The patent combines a glass plate with insulating layers to create a composite support member. This composite structure maintains the rigidity benefits of glass while the insulating layers provide protection against breakage, thereby improving reliability without sacrificing structural stability.
Solution Approach 2:
The insulating layers are positioned around the glass plate to provide protective cushioning beforehand. This protective structure prevents direct stress concentration on the glass, reducing the likelihood of breakage while maintaining the rigidity advantages of the glass substrate.
3Ease of manufacture
If traditional single-material support structures are used, then the manufacturing process is simple, but the structural integrity is insufficient for reduced thickness designs
Solution Approach 1:
The patent employs a composite support member consisting of a glass plate and insulating layers. This composite structure enhances structural integrity and stability, enabling reduced thickness designs while maintaining sufficient mechanical strength. The integration of multiple materials provides both structural support and protective functions within a unified manufacturing process.
Data Source
AI summary
A fan-out semiconductor package includes: a support member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the support member and the semiconductor chip; and a connection member disposed on the support member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The support member includes a glass plate and an insulating layer connected to the glass plate.