Fe-Ni Metal Mask Surface Control for Uniform Etching and Low Warpage

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current metal mask materials for organic EL displays face challenges in achieving high-definition pattern formation with minimal side etching and improved adhesion to resist, despite advancements in etching processability.

Innovation Solution

A metal mask material composed of an Fe-Ni alloy with specific chemical composition and surface roughness characteristics, including C: 0.01% or less, Si: 0.5% or less, Mn: 1.0% or less, and Ni: 30 to 50%, with controlled surface roughness and skewness, and a production method involving cold rolling with optimized rolling reduction ratio and bite angle, to enhance adhesion and minimize shape change during etching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If surface roughness is reduced to improve etching uniformity, then etching processability is improved, but adhesion to resist deteriorates

Engineering Contradiction:
Improveetching uniformityVSAvoidadhesion to resist
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies local quality by creating different surface roughness characteristics in different directions. The surface roughness in the rolling direction is controlled at Ra 0.03-0.15 μm for good adhesion, while the surface roughness perpendicular to the rolling direction is controlled at Ra 0.08-0.20 μm for uniform etching. This directional differentiation allows the same surface to simultaneously satisfy both adhesion requirements and etching uniformity requirements.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If etching pattern definition is improved, then manufacturing precision is improved, but side etching increases

Engineering Contradiction:
Improvepattern definitionVSAvoidside etching
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by precisely controlling multiple surface parameters simultaneously: surface roughness in rolling direction (Ra 0.03-0.15 μm), surface roughness perpendicular to rolling direction (Ra 0.08-0.20 μm), and skewness (Rsk ≥ 0). By optimizing these parameters together rather than individually, the patent achieves high pattern definition while suppressing side etching through the combined effect of appropriate surface characteristics.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If surface roughness is increased to improve adhesion to resist, then reliability is improved, but etching uniformity deteriorates

Engineering Contradiction:
Improveadhesion to resistVSAvoidetching uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies asymmetry by intentionally creating asymmetric surface roughness characteristics where the surface roughness perpendicular to the rolling direction (Ra 0.08-0.20 μm) is deliberately made larger than the surface roughness in the rolling direction (Ra 0.03-0.15 μm). This asymmetric configuration allows the surface to provide sufficient adhesion through the perpendicular roughness while maintaining etching uniformity through the controlled rolling direction roughness.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentEP3508285B1Metal mask material and production method therefor
Publication Date: 2021.09.29 PROTERIAL LTD

AI summary

Provided are: a metal mask material the shape change of which after etching is suppressed and which is preferable in order to achieve good resist adhesiveness and good etching workability; and a production method for the metal mask material. The metal mask material has a surface roughness in the rolling direction and a surface roughness in a direction perpendicular to the rolling direction, which satisfy 0.05 µm≤Ra≤0.25 µm and Rz≤1.5 µm. The metal mask material has a skewness Rsk of 0 or greater in the direction perpendicular to the rolling direction. When a sample having a length of 150 mm and a width of 30 mm is cut out of the metal mask material and the thickness of the sample is reduced by 60% by etching from one side of the sample, the amount of warpage of the sample is 15 mm or less. The metal mask material has a thickness of 0.10-0.5 mm.