High-Voltage Feed-Through Capacitor Resin Layout for Breakdown Prevention
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Solution Overview
Problem
High-voltage feed-through capacitors face reliability issues due to dielectric breakdown caused by high inter-conductor electric field intensity, which is influenced by the electrical resistivity of the resins used in their configuration.
Innovation Solution
The design incorporates a second resin with lower electrical resistivity than the first resin, strategically placed between the element body and the through-conductor, to decrease the inter-conductor electric field intensity and prevent dielectric breakdown.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-voltage feed-through capacitor uses conventional resin configuration, then structural simplicity is maintained, but dielectric breakdown occurs due to high inter-conductor electric field intensity
Solution Approach 1:
The patent applies local quality by using two different resins with different electrical resistivities in different locations. The first resin (higher electrical resistivity) is used in the case, while the second resin (lower electrical resistivity) is specifically placed in the cover surrounding the through-conductor. This localized differentiation of material properties addresses the high electric field intensity problem at the critical through-conductor interface without requiring complete redesign of the entire structure.
Solution Approach 2:
The patent changes the electrical resistivity parameter of the resin material in the cover area. By selecting a second resin with lower electrical resistivity than the first resin, the patent modifies the electrical parameters of the insulating structure to reduce electric field intensity. This parameter change directly addresses the dielectric breakdown issue while maintaining the overall structural configuration.
2Reliability
If second resin with lower electrical resistivity is used in the cover, then inter-conductor electric field intensity is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the insulating structure into two distinct parts: a case filled with first resin and a cover filled with second resin. This segmentation allows each resin to be optimized for its specific function while maintaining clear manufacturing boundaries. The case and cover can be manufactured and filled with appropriate resins in separate steps, making the dual-resin configuration manufacturable despite the increased material specification requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the electric field intensity, enhancing the reliability of the high-voltage feed-through capacitor by preventing dielectric breakdown and ensuring stable operation.
Implementation Method 1
The second resin has an electrical resistivity less than an electrical resistivity of the first resin. A configuration in which the second resin has an electrical resistivity less than an electrical resistivity of the first resin decreases the inter-conductor electric field intensity.
Implementation Method 2
An intensity of an electric field that is formed between the second electrode and the through-conductor has an influence on reliability of the high-voltage feed-through capacitor. The inter-conductor electric field intensity is high, dielectric breakdown tends to occur.
Data Source
AI summary
An element body is formed with a through hole to be open at a first main surface and a second main surface opposing each other. A through-conductor includes a first portion located inside the through hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A first resin is contained in the case and coats the element body. A second resin is contained in the cover and is located in a space between an inner surface of the element body and the first portion. The second resin has an electrical resistivity less than an electrical resistivity of the first resin.