Ferrite Chip Component for High Frequency Noise Suppression
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Solution Overview
Problem
Existing circuit boards struggle with high frequency noise suppression due to manual mountability issues and stray capacitance generated by conventional inductors, which can lead to ineffective noise conduction and reflection in high frequency bands.
Innovation Solution
A circuit board design featuring a magnetic chip component with a ferrite body disposed on an interconnect pattern, absorbing magnetic field energy and preventing stray capacitance, allowing for efficient suppression of high frequency noise conduction and reflection, while maintaining excellent mountability through standardized mounting processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a magnetic body is stuck to the printed circuit board to adjust inductance, then inductance adjustment precision is improved, but manual mounting is required which reduces mountability
Solution Approach 1:
The patent combines the inductance adjustment function with the noise suppression function into a single integrated component. The magnetic body is embedded within the chip component structure itself rather than being a separate adjustable element, allowing the component to be mounted using standard automated SMT processes while maintaining precise inductance characteristics.
Solution Approach 2:
The chip component is designed with predetermined inductance values that are factory-calibrated, eliminating the need for field adjustment. The component serves itself by providing both the magnetic coupling and the noise suppression function through its internal structure, requiring no additional manual intervention during assembly.
2Manufacturing precision
If a conductor pattern is formed inside the ferrite body, then inductance can be adjusted, but stray capacitance is generated which reduces high frequency characteristics
Solution Approach 1:
The patent removes the internal conductor pattern from the ferrite body, extracting the source of stray capacitance. Instead of having conductors embedded within the magnetic material, the design uses external terminals that connect to the ferrite body's magnetic domains, eliminating parasitic capacitance while preserving the inductance function.
Solution Approach 2:
The ferrite body is designed with localized magnetic properties rather than requiring贯穿 conductors. Different regions of the ferrite material are optimized for specific functions: some regions provide magnetic coupling while others provide electrical isolation, achieving both inductance control and high frequency performance through spatial differentiation of material properties.
3Object-affected harmful factors
If a high frequency inductor is used to suppress noise conduction, then noise conduction is suppressed, but noise reflection occurs which radiates secondarily
Solution Approach 1:
The patent converts the potential harmful reflection into a beneficial absorption effect. By using a ferrite body with specific magnetic loss characteristics, the component absorbs the reflected noise energy and dissipates it as heat, transforming what would be a secondary radiation problem into an additional noise suppression mechanism.
Solution Approach 2:
The chip component uses composite material structure combining ferrite magnetic material with lossy dielectric materials. This composite construction provides both the inductance function through the ferrite's magnetic permeability and the damping function through the dielectric's loss tangent, simultaneously addressing noise conduction suppression and reflection mitigation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses high frequency noise conduction and reflection in the circuit board, maintaining superior transmission and reflection characteristics in high frequency bands, and enhances mountability by eliminating manual assembly requirements.
Implementation Method 1
a chip component (a body) composed of a magnetic body and disposed on the interconnect pattern allows the magnetic body to absorb the magnetic field's energy
Data Source
AI summary
A circuit board with a measure against high frequency noise includes: an interconnect substrate having an interconnect pattern to which an IC which is a source of high frequency noise is electrically connected; a pair of lands provided on a mounting surface of the interconnect substrate; and a chip component having a body composed of a magnetic body (i.e., ferrite) in a rectangular parallelepiped, and a pair of external electrodes provided at opposite ends of the body, the pair of external electrodes being connected to the pair of lands, the body being disposed on the interconnect pattern, as observed in a direction perpendicular to the mounting surface.