Ferroelectric Memory Cell Structure to Reduce Disturb

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Solution Overview

Problem

Existing ferroelectric memory devices face issues with disturb during operation, which affects the reliability and performance of the memory storage.

Innovation Solution

The introduction of a series connected select gate transistor reduces disturb by incorporating a first field effect transistor with a non-ferroelectric gate dielectric and a second field effect transistor with a ferroelectric gate dielectric, forming a unique structure with semiconductor channels and gate electrodes that minimize interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional ferroelectric memory device structure is used, then the device can store information using ferroelectric material, but disturb occurs during operation which reduces reliability

Engineering Contradiction:
Improveoperational reliabilityVSAvoiddisturb
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The memory device is divided into two separate transistors: a first transistor with non-ferroelectric gate dielectric and a second transistor with ferroelectric gate dielectric. This segmentation allows the ferroelectric material to be isolated in one transistor, reducing its harmful disturbance effect on other cells while maintaining its useful memory storage function in the second transistor.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The first transistor with non-ferroelectric gate dielectric acts as an intermediary element between the control circuitry and the ferroelectric memory transistor. This intermediary structure mediates the control signals and reduces the direct disturbance from the ferroelectric material, allowing reliable operation while preserving memory functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If ferroelectric material is used for memory storage, then data can be retained, but disturb during operation affects performance

Engineering Contradiction:
Improvedata retentionVSAvoiddisturb
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

By separating the ferroelectric material into a dedicated second transistor, the device maintains data retention capability while isolating the disturbance effect. The first transistor handles control functions without ferroelectric disturbance, while the second transistor preserves memory storage with minimized interference on surrounding cells.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The ferroelectric material is localized specifically in the second transistor's gate dielectric, allowing data retention in that region while the first transistor and surrounding areas experience reduced disturbance. This local concentration of ferroelectric property achieves both data retention and reduced harmful effects.

Inventive Principle:
Principle #3Local quality

3Object-affected harmful factors

If a series connected select gate transistor structure is implemented, then disturb is reduced, but device complexity increases

Engineering Contradiction:
Improvedisturb reductionVSAvoidtransistor structure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The memory cell is segmented into two transistors connected in series, where each transistor has a specific function. This segmentation reduces disturb by isolating the ferroelectric material to one transistor, and the increased complexity is justified by the significant improvement in reliability and disturbance reduction.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the operational stability and reliability of ferroelectric memory devices by reducing disturb, thereby improving data retention and overall performance.

Implementation Method 1

A ferroelectric material refers to a material that displays spontaneous polarization of electrical charges in the absence of an applied electric field. The net polarization P of electrical charges within the ferroelectric material is non-zero in the minimum energy state.

Methodology Applied
Scientific EffectSpontaneous polarization: Hysteresis

Implementation Method 2

Polarization P of a ferroelectric material as a function of an applied voltage V thereacross displays hysteresis.

Methodology Applied
Scientific EffectHysteresis: Hysteresis

Implementation Method 3

The different orientations of the dipole moment of the ferroelectric material can be detected by the electric field generated by the dipole moment of the ferroelectric material. For example, the orientation of the dipole moment can be detected by measuring electrical current passing through a semiconductor channel provided adjacent to the ferroelectric material in a field effect transistor ferroelectric memory device.

Methodology Applied
Scientific EffectField effect: Conduction (electrical)

Data Source

PatentEP3895213B1Ferroelectric memory device containing a series connected select gate transistor and method of forming the same
Publication Date: 2026.03.18 SANDISK TECHNOLOGIES LLC
  • EP3895213B1 patent drawingFigure 1A
  • EP3895213B1 patent drawingFigure 1B
  • EP3895213B1 patent drawingFigure 1C~1D

AI summary

A ferroelectric memory unit cell includes a series connection of select gate transistor that turns the ferroelectric memory unit cell on and off, and a ferroelectric memory transistor. Data is stored in a ferroelectric material layer of the ferroelectric memory transistor. The ferroelectric memory unit cell may be a planar structure in which both transistors are planar transistors with horizontal current directions. In this case, the gate electrode of the access transistor can be formed as a buried conductive line. Alternatively, the ferroelectric memory unit cell may include a vertical stack of vertical semiconductor channels.