Fiber Optic Connector Clip for High-Density Data Center Access

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Solution Overview

Problem

High-density fiber optic connectors in data centers face challenges with access and stress on cables and connectors, leading to potential damage and network disruptions due to obstructed release mechanisms and increased support costs.

Innovation Solution

A remote release mechanism and clip system that secures multiple connectors, allowing for easy insertion and removal without damaging surrounding connectors, using a clip to align and secure connectors in dense arrays, enabling efficient access and reducing stress on cables.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If connectors are placed in high-density configurations, then the quantity of connectors per footprint is increased, but access to individual release mechanisms becomes difficult and support time increases

Engineering Contradiction:
Improvenumber of connectors per footprintVSAvoidsupport time for connector access
Core Design Contradiction:
Quantity of substanceVSLoss of time

Solution Approach 1:

The patent combines multiple individual connector release mechanisms into a single integrated release mechanism that can simultaneously release multiple connectors. This allows an operator to access and release multiple connectors through one unified interface rather than having to individually access each obscured release mechanism, thereby reducing support time while maintaining high connector density

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The release mechanism is designed to perform multiple functions: it can release individual connectors selectively or release multiple connectors simultaneously through a single operational interface. This multi-functionality allows the same mechanism to serve both individual access needs and bulk release operations, addressing the time loss issue without reducing connector density

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Quantity of substance

If connectors are placed in high-density configurations, then the quantity of connectors per footprint is increased, but adjacent connectors and cables obstruct access to release mechanisms

Engineering Contradiction:
Improvenumber of connectors per footprintVSAvoidaccessibility of release mechanism
Core Design Contradiction:
Quantity of substanceVSEase of operation

Solution Approach 1:

The patent combines multiple individual connector release mechanisms into a single integrated release mechanism that is accessible from a unified location. This eliminates the obstruction problem by providing one accessible interface that controls multiple connectors, rather than having multiple obscured individual release mechanisms hidden among dense connectors and cables

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated release mechanism acts as an intermediary between the operator and the multiple individual connectors. Instead of the operator directly accessing each individual release mechanism (which is obstructed), the intermediary mechanism provides indirect but accessible control over all connectors through a single operational interface

Inventive Principle:
Principle #24Intermediary (Mediator)

3Quantity of substance

If connector size is reduced to increase density, then the quantity of connectors per footprint is increased, but the robustness and ease of deployment diminish

Engineering Contradiction:
Improvenumber of connectors per footprintVSAvoidrobustness of connector
Core Design Contradiction:
Quantity of substanceVSStrength

Solution Approach 1:

The patent combines multiple connectors into a unified assembly that is secured by a single integrated release mechanism. This allows individual connectors to maintain their full size and robustness while achieving high overall density through the consolidated release system. The connectors themselves are not shrunk, but their collective management is streamlined

Inventive Principle:
Principle #5Merging (Combining)

4Quantity of substance

If spacing between adjacent connectors is reduced to increase density, then the quantity of connectors per footprint is increased, but quality of service and support cost are negatively impacted

Engineering Contradiction:
Improvenumber of connectors per footprintVSAvoidquality of service
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent combines multiple connectors into a unified assembly with a single integrated release mechanism. This allows connectors to be placed in high-density configurations while maintaining service quality because any issues can be addressed through the unified mechanism without requiring individual access to each connector. The consolidation improves reliability by reducing the complexity of individual connector management

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10852490B2Fiber optic connector clip
Publication Date: 2020.12.01 SENKO ADVANCED COMPONENTS INC
  • US10852490B2 patent drawing
  • US10852490B2 patent drawing
  • US10852490B2 patent drawing

AI summary

An adapter holding a plurality of connectors and a clip positioned around a group of connectors securing the connectors together as a single assembly. The clip removes the group connectors from the adapter upon removal therefrom.