Coupling Light Guides TRIZ Cases

An optical subassembly uses an angled lens to focus incoming signals onto a photodetector target.

A molded plastic leadframe integrates optoelectronic elements within a single plug body to eliminate separate optical connectors.

A segmented optical element uses distinct condensing lenses to focus signal and feed light onto separate photodetectors.

Slanted blades scratch optical fibers to reduce glass protrusion, minimizing insertion loss and back-reflection during splicing.

Forward Brillouin scattering in silica micro-resonators achieves non-reciprocal transparency without magnetic fields, reducing device complexity.

A transceiver extension device relocates the optical module outside the enclosure to maintain signal integrity.

Segmented waveguide cores with variable thickness profiles resolve electromagnetic field confinement issues while improving mode transformation efficiency.

Angled coupling redirects optical signals through hollow waveguides and reflective surfaces to prevent signal degradation from sharp bends.

Tip/tilt/piston MEMS micromirrors adjust beam angles to tune transit time, reducing insertion loss and enhancing dynamic range.

A compact fiber storage module uses a movable connector adapter to route optical fibers within a small enclosure.

Glass ferrule isolates delivery optical fiber from cooling water in a water-cooled package to maintain beam quality.

Spring-biased pivoting alignment pins compensate for manufacturing-induced angular misalignment between mated ferrules to ensure physical contact.

Movable comb electrodes on a mirror detect tilt angle via capacitance changes, overcoming piezoelectric hysteresis and creep for precise control.

Segmented tapered boots collapse under side loads to protect fibers while minimizing connector volume.

A field installable fiber optic connector housing uses integrated sealing boots and seal nuts to protect connection points from environmental damage.

An optical inspection circuit couples light via a grating coupler to a germanium photodiode for detection.

Segmented housing and radius limiters manage cable slack in high-density racks, preventing signal loss during access.

A transparent spacer over a photonic integrated circuit enables top-side optical access, resolving alignment precision challenges during encapsulation.

Remote release mechanism merges individual connector interfaces to reduce support time in dense arrays.

A lens array prism recessing section captures excess adhesive to prevent optical path contamination.

Separate waveguides on a photonic integrated circuit isolate excitation and detection paths, eliminating signal loss from splitters and noise from circulators.

Integrated slope surfaces reflect and refract light for vertical incidence, eliminating separate reflectors to reduce alignment errors and manufacturing costs.

A silica waveguide with etched grooves accepts separately manufactured micro-mirrors for vertical light coupling.

Stacked substrates with differential terminal lengths simplify the optical transmission module structure while stabilizing high frequency signal integrity.

An elastomeric body with matched refractive index guides light between optical waveguides and electro-optical components.

Asymmetric optical ports grip round fibers to enable precise mechanical alignment during module assembly.

A substrate-mounted turning mirror redirects laser light through the chip for vertical coupling, protecting the diode from back reflections.

Orthogonal walls and clips retain ferrules in alignment, preventing microscopic separation that increases insertion loss under side-loading forces.

Segmented couplers with optimized gaps maximize extinction ratios above 25 dB across the C-band while maintaining low insertion loss.

A reconfigurable all-optical nonlinear activation device uses a directional coupler and interferometer to generate configurable activation functions.

Piezoelectric actuators adjust fiber blocks on the substrate, resolving alignment stability versus realignment capability trade-offs.

Diffraction gratings separate perpendicular TE and TM polarizations, reducing coupling loss while maintaining a thin planar structure.

A multi-fiber optical connector uses a twist-to-lock fastener to secure the housing and manage excess fiber length.

A sliding member restrains or releases a boot structure, resolving the trade-off between connection stability and polarity adaptability.

A tunable edge coupler adjusts its waveguide core refractive index to match optical fiber modes.

Birefringence waveguide section induces phase shift to align TE and TM passband peaks in silicon photonic delay line interferometers.

Vertical coupling through recessed mirrors reduces optical loss while enabling high-density mounting of optical integrated circuits in compact modules.

A two-core optical connector plug uses a lever coupler to invert holder positions for polarity adjustment.

A connector device uses a reflection surface to redirect optical signals between propagation directions.

An oxygen-filled hermetic housing stabilizes electrical connections in a thinned lithium niobate substrate, reducing DC drift and current variation.

Spring-loaded fiber optic contacts match electrical connector dimensions, eliminating epoxy assembly time while maintaining reliable optical connections.

An annular detector region absorbs light leakage from the waveguide core, eliminating external drop bus waveguides and reducing device footprint.

Slidable modules on a pivotable chassis increase fiber density while maintaining accessibility for maintenance.

Curved ramps in a connector housing engage a ferrule flange to guide precise rotational alignment, maintaining sub-1° tolerance for angle polished ferrules.

A compact optical micro bench integrates a thermoelectric controller to stabilize laser alignment within silicon photonic transceivers.

A multi-taper optical coupler converts propagation modes adiabatically to match waveguide and fiber interfaces.

Fixation pin through optical circuit board maintains alignment under temperature fluctuations while enabling easy removal for repair.

An electrically insulating ring in the optical receptacle isolates signal ground from chassis ground.

A glass packaging substrate transmits signals via light energy through optical vias, reducing wiring pitch constraints.