Optical Micro Bench for Transceiver Thermal Stability
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Solution Overview
Problem
Current silicon photonic systems face challenges in efficiently coupling light from the laser active region to the photonic integrated circuit (PIC) due to mechanical and thermal instability, requiring hybrid integration and active cooling, which complicates the design and increases the aspect ratio of the supporting platform, affecting heat dissipation and component reliability.
Innovation Solution
A compact optical transceiver sub-assembly with a silicon photonic platform featuring a folded optical path, a housing chamber, optical micro bench, thermoelectric temperature controller (TEC), and a prism that folds light from the laser source in a reverse direction, ensuring stable mechanical and thermal support while maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hybrid integration is used to couple light from laser to silicon photonic PIC, then light coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent introduces a microlens as an intermediary component between the laser source and the silicon photonic PIC. This microlens focuses and directs the light beam, enabling efficient coupling without requiring complex hybrid integration structures. The microlens acts as a mediator that simplifies the coupling interface while maintaining high light transfer efficiency.
2Stability of the object's composition
If active cooling with TEC is added to the laser, then thermal stability is improved, but device complexity increases
Solution Approach 1:
The patent combines the TEC cooling system with the existing platform structure by integrating it into the housing chamber. The TEC is positioned to directly cool the laser source, and its thermal management function is merged with the mechanical support structure. This integration reduces the number of separate cooling components and simplifies the overall system architecture while maintaining effective thermal control.
3Reliability
If the platform provides mechanical support and environmental protection, then component reliability is improved, but the aspect ratio increases affecting heat dissipation
Solution Approach 1:
The patent transitions from a linear arrangement to a three-dimensional integrated structure within the housing chamber. Components are positioned in multiple dimensions rather than along a single line, allowing the platform to provide comprehensive mechanical support and environmental protection while maintaining compact dimensions. This 3D integration improves heat dissipation by reducing the aspect ratio and enabling more efficient thermal pathways in multiple directions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides thermal stability and mechanical isolation, enhancing the efficiency of the TEC and preventing environmental disturbances, thus ensuring reliable operation and improved heat dissipation within a compact, hermetically sealed package.
Implementation Method 1
The heat generated by laser or other active components can dissipate through the thermal path of the platform. Then the TEC brings the heat to its hot surface by electricity.
Implementation Method 2
the prism folds light from the laser source in a reverse direction from original path
Implementation Method 3
the thermoelectric temperature controller (TEC) cools heating elements in the optical transceiver sub-assembly
Data Source
AI summary
An optical transceiver sub-assembly (100) integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber (105) and a top cover (110) to enclose elements of the optical transceiver sub-assembly (100) other than the housing chamber (105) and the top cover (110), a bottom housing module (115) accommodating an optical micro integration (130). In particular, the optical transceiver sub-assembly (100) is operably configured to establish an optical-electrical communication with an outside surrounding.