Glass Packaging Substrate Optical Signal Transmission
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently transmitting signals between photoelectric devices due to limitations in reducing wiring pitch and differences in thermal expansion coefficients, which hinder the miniaturization and performance of electronic devices.
Innovation Solution
A packaging substrate utilizing a glass substrate with a core layer, insulating layer, and light transmitting and receiving portions, where signals are transmitted and received in the form of light energy through the glass substrate, reducing the space required for electrical connection structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin substrates are used for packaging, then it is possible to mount relatively high-performance, high-frequency semiconductor elements, but there are limitations in reducing the pitch of the wiring
Solution Approach 1:
The patent replaces electrical signal transmission through conductive wiring with optical signal transmission through light-transmissive vias and optical fibers. This substitution allows signals to be transmitted without being constrained by electrical conductivity requirements, enabling significant reduction in wiring pitch while maintaining high-frequency performance
Solution Approach 2:
The patent changes the transmission medium from electrical conductors to optical waveguides, fundamentally altering the parameter of signal transmission from electrical to optical domain. This enables the via structures to be made much smaller since optical transmission doesn't require the same wiring pitch constraints as electrical signaling
2Length of moving object
If through-holes are formed in silicon substrates and conductive materials are applied, then wiring between element and motherboard can be shortened with good electrical characteristics, but the substrate size and complexity increase
Solution Approach 1:
The patent replaces conventional electrical through-hole wiring in silicon substrates with optical transmission through light-transmissive vias in glass substrates. This eliminates the need for conductive material filling and complex electrical interconnections, reducing both substrate size and structural complexity while achieving short effective transmission paths
Solution Approach 2:
The patent uses composite structures combining glass substrates with light-transmissive via materials (such as air, vacuum, or optical resin) to create a packaging substrate that achieves both compact size and efficient signal transmission without requiring thick silicon substrates and multiple conductive layers
3Length of moving object
If glass substrate is used for high-end packaging, then wiring can be shortened with good electrical characteristics, but the manufacturing complexity increases due to through-hole formation and conductive material application
Solution Approach 1:
The patent replaces complex electrical wiring processes (drilling, plating, filling) with simpler optical transmission structures. The light-transmissive vias can be formed through standard glass processing techniques and filled with optical materials or left as air/vacuum channels, eliminating multiple complex manufacturing steps required for electrical conductors
Solution Approach 2:
The patent introduces light-transmissive via structures as intermediary elements that replace complex electrical interconnection systems. These via structures serve as both mechanical support and optical waveguides, simplifying the overall manufacturing process while achieving short transmission paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables compact fabrication of packaging substrates, enhances signal transmission efficiency, and improves the sensing performance of photoelectric sensors by reducing the space needed for electrical connections.
Implementation Method 1
a glass substrate having first and second surfaces facing each other... signals are transmitted and received in the form of light energy through the glass substrate
Data Source
Figure 1~2
Figure 3(a)~3(b)
Figure 4(a)~4(e)
AI summary
The present disclosure relates to a manufacturing method for a packaging substrate and a packaging substrate utilizing the method. The packaging substrate according to the present disclosure includes; a core layer including a glass substrate having first and second surfaces facing each other and a cavity portion; an insulating layer formed on the first surface; and a light transmitting portion formed on an upper surface of the insulating layer, wherein a light receiving portion is disposed in the cavity portion, the insulating layer includes a via penetrating in a thickness direction, and a portion of a lower surface of the light transmitting portion may abut on the via. Though it, the packaging substrate may be compactly manufactured by reducing the space for the configuration of electrically connecting the conventional photoelectric elements, and the effect of improving the sensing efficiency and performance of the photoelectric sensor relative to the space may occur.