Fiber-Containing Resin Substrate for Wafer Encapsulation Stability
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Solution Overview
Problem
Conventional methods for encapsulating large-diameter semiconductor wafers or substrates face issues with warping and peeling due to contraction stress during curing, leading to poor encapsulation performance and mass production challenges.
Innovation Solution
A fiber-containing resin substrate with a resin-impregnated fibrous base material and an uncured thermosetting resin layer is used, which has a low linear expansion coefficient to minimize contraction stress, ensuring effective encapsulation without warping or peeling, and providing excellent heat and humidity resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid epoxy resin or epoxy molding compound is used for encapsulation by compression molding, then encapsulation performance is improved, but warping and peeling occur due to contraction stress during curing
Solution Approach 1:
The invention changes the key parameter of linear expansion coefficient from conventional values (typically 50-100 ppm/°C for epoxy resins) to an extremely low value of less than 3 ppm/°C. This parameter change fundamentally alters the thermal behavior during curing, reducing contraction stress to negligible levels while maintaining excellent encapsulation performance with heat and humidity resistance.
Solution Approach 2:
The invention creates a composite material system combining resin with fibrous reinforcement (such as glass fibers or carbon fibers) to form a fiber-containing resin substrate. This composite structure provides dimensional stability during curing while maintaining the encapsulation benefits of the resin, effectively suppressing warping and peeling through the synergistic combination of materials.
2Stability of the object's composition
If filler is added to resin composition to lower contraction stress, then warping is suppressed, but viscosity increases causing device peeling
Solution Approach 1:
Instead of changing composition (adding filler), the invention changes the fundamental parameter of linear expansion coefficient through material selection (fibrous reinforcement). This approach suppresses warping without increasing viscosity, as the fibrous structure provides dimensional stability through its inherent low thermal expansion properties rather than through filler particle packing.
3Stability of the object's composition
If resin composition with lower elasticity is used to suppress warping, then substrate stability is improved, but encapsulation performance deteriorates
Solution Approach 1:
The invention uses a composite material system where fibrous reinforcement provides the dimensional stability (low elasticity effect) needed to suppress warping, while the resin matrix maintains the encapsulation performance (heat and humidity resistance). The fibrous network acts as a structural scaffold that prevents warping without compromising the protective encapsulation properties.
Solution Approach 2:
The invention changes the elastic modulus parameter through fibrous reinforcement while maintaining the chemical composition of the resin matrix. This allows the material to exhibit lower effective elasticity (suppressing warping) while preserving the resin's inherent heat and humidity resistance properties for excellent encapsulation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses warping and peeling of large-diameter wafers or substrates, maintaining high-quality semiconductor devices with enhanced encapsulation performance, including heat and humidity resistance.
Implementation Method 1
the resin-impregnated fibrous base material having a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm
Data Source
AI summary
A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material.