Fiber-Based RRAM Devices for Low Power Wearable Memory

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Solution Overview

Problem

Existing electronic devices on silicon or glass substrates face limitations in energy efficiency and integration density, particularly in applications like smart clothes and bio-signal detection, where nonvolatile memory devices are needed to minimize static power consumption.

Innovation Solution

Resistive Random Access Memory (RRAM) devices are formed on fibers, comprising a lower electrode, memory resistance layer, and upper electrode, with optional intermediate and insulation layers, using materials like silicon oxide and conductive polymers, and connected to textile-based sensor systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If nonvolatile memory devices are used to minimize static power consumption, then energy efficiency is improved, but integration density and speed may be reduced

Engineering Contradiction:
Improvestatic power consumptionVSAvoidintegration density and speed
Core Design Contradiction:
Use of energy by moving objectVSProductivity

Solution Approach 1:

The patent changes the physical and chemical parameters of the memory resistance layer by using different oxide materials (silicon oxide, tungsten oxide, niobium oxide, hafnium oxide, titanium oxide, tantalum oxide, vanadium oxide, copper oxide) and controlling their thickness (5 nm to 50 nm) to achieve both nonvolatile memory characteristics and high-speed operation with low power consumption

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite structures combining fiber substrates with multiple functional layers including conductive materials (silver, copper, aluminum, gold) and oxide materials to create an integrated memory device that achieves both energy efficiency and high performance

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If RRAM devices are formed on fiber substrates for advanced applications, then adaptability to smart clothes and sensor systems is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveapplication flexibilityVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent creates a universal memory device platform on fiber substrates that can be applied to multiple advanced applications including smart clothes, textile-based sensor systems, dielectric elastomer actuators, and bio-signal detection, making the device adaptable to various flexible and wearable electronics

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses flexible fiber substrates with thin film structures (oxide layers 5-50 nm thick, conductive layers) to create bendable and flexible memory devices suitable for wearable applications, replacing rigid silicon substrates

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The RRAM devices on fibers provide stable, energy-efficient nonvolatile memory with high integration density and speed, suitable for advanced applications, maintaining resistance states over numerous operations and extended periods.

Implementation Method 1

a memory resistance layer disposed on the lower electrode

Methodology Applied
Scientific EffectResistive switching: Electrical Resistance

Data Source

PatentUS9496494B2Resistive random access memory devices formed on fiber and methods of manufacturing the same
Publication Date: 2016.11.15 SAMSUNG ELECTRONICS CO LTD
  • US9496494B2 patent drawing
  • US9496494B2 patent drawing
  • US9496494B2 patent drawing

AI summary

Provided is a memory device formed on a fiber. The memory device includes a lower electrode, a memory resistance layer, and an upper electrode, which are sequentially formed on a surface of the fiber. The memory resistance layer may have variable resistance properties. The memory device may further include an intermediate electrode and a switching layer formed between the memory resistance layer and the upper electrode.