Embedding Filaments in 3D Thermoplastic Structures
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current additive manufacturing (AM) techniques for 3D structural electronics face limitations due to low reliability, performance, and high cost of low-temperature cured conductive ink technologies, which restrict their application to simple devices and fail to achieve mechanical strength and durability comparable to injection molded parts.
Innovation Solution
Embedding filaments or meshes within thermoplastic substrates during the fabrication of complex 3D structures using ultrasonic energy and heat to create electrical interconnects with improved conductivity and mechanical strength, enabling the production of composite structures with enhanced mechanical and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive ink-based technology is used for 3D structural electronics, then manufacturing complexity is reduced, but reliability and performance deteriorate
Solution Approach 1:
The patent uses composite materials by embedding conductive filaments (metal or conductive polymer) within thermoplastic substrate layers. This combination provides both the ease of additive manufacturing and the reliability of robust conductive pathways, as the filament-embedded structures offer superior electrical conductivity and mechanical strength compared to conductive inks alone.
Solution Approach 2:
The patent changes the physical state and properties of materials by using thermoplastic substrates that can be melted and reformed during the additive manufacturing process. This allows the substrate to flow around and encapsulate the conductive filaments, creating strong mechanical bonds while maintaining electrical conductivity, thus resolving the contradiction between ease of manufacture and reliability.
2Device complexity
If conductive ink-based technology is used for 3D structural electronics, then device complexity is reduced, but performance deteriorates
Solution Approach 1:
By combining conductive filaments with thermoplastic substrates, the patent creates composite structures that maintain simple device geometry while achieving high electrical conductivity. The filament material (metal or conductive polymer) provides superior conductive pathways compared to conductive inks, while the thermoplastic matrix maintains structural integrity.
3Strength
If filament embedding is used during AM fabrication, then mechanical strength is improved, but process complexity increases
Solution Approach 1:
The patent merges multiple functions into a single additive manufacturing process: the thermoplastic substrate is deposited, conductive filaments are embedded within the molten material, and the substrate encapsulates the filaments all in one continuous operation. This integration improves mechanical strength through filament reinforcement while avoiding the need for separate embedding steps, thus not increasing overall process complexity.
Solution Approach 2:
The thermoplastic substrate performs multiple functions: it provides structural support, encapsulates the conductive filaments for mechanical protection, and facilitates heat transfer during the manufacturing process. The substrate's molten state automatically flows around the filaments, eliminating the need for complex positioning mechanisms and reducing process complexity.
4Reliability
If traditional PCB technology is used, then electrical interconnect reliability is maintained, but 3D structural freedom is lost
Solution Approach 1:
The patent transitions from traditional 2D PCB layouts to 3D embedded conductive structures by depositing thermoplastic layers and embedding filaments within the bulk material. This allows electrical interconnects to be positioned in three-dimensional space, enabling complex spatial arrangements while maintaining reliable electrical connections through the use of robust conductive filaments encapsulated in the thermoplastic matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the mechanical strength of AM-manufactured parts by 37% and allows for the creation of reliable electrical interconnects, enabling the production of complex 3D electronics with high reliability and expanded market potential, including applications in smart prosthetics and mission-specific UAVs.
Implementation Method 1
Embedding filaments or meshes within thermoplastic substrates during the fabrication of complex 3D structures using ultrasonic energy and heat
Implementation Method 2
Embedding filaments or meshes within thermoplastic substrates during the fabrication of complex 3D structures using ultrasonic energy and heat
Data Source
AI summary
The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.