Filled Heat Dissipation Substrate for Power Module Reliability
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Solution Overview
Problem
Conventional heat dissipation substrates for power semiconductor modules face issues with reduced heat dissipation performance and reliability due to high temperature and high voltage environments, leading to thermal runaway and potential module destruction, especially in high-performance electric vehicles.
Innovation Solution
A heat dissipation substrate design featuring an insulating substrate with fillers and metal plates, where fillers are disposed within the substrate to enhance heat transfer and bonding, and a pin-fin structure is added to improve thermal conductivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation substrates are used in high temperature and high voltage environments, then the power semiconductor module can operate, but heat dissipation performance deteriorates and thermal runaway occurs
Solution Approach 1:
The patent employs a composite structure consisting of an insulating substrate (ceramic material) combined with metal plates (copper or aluminum) and filler materials. This composite design leverages the high thermal conductivity of metals while maintaining the electrical insulation and high-temperature resistance of ceramic substrates, thereby improving heat dissipation performance without compromising reliability in high-temperature environments.
Solution Approach 2:
The patent introduces a three-dimensional heat dissipation architecture by adding fillers within the insulating substrate and creating protrusions on metal plate surfaces. This dimensional enhancement increases the heat transfer area and creates multiple heat conduction paths, effectively improving heat dissipation performance and preventing thermal runaway.
2Temperature
If the heat transfer area is increased to improve heat dissipation, then heat dissipation performance improves, but the structural complexity increases
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent components: the insulating substrate, metal plates with protrusions, and fillers. Each component performs a specific heat transfer function, and their modular arrangement increases the effective heat transfer area without creating a monolithic complex structure, thereby improving heat dissipation while managing structural complexity.
3Strength
If metal plates are bonded directly to the insulating substrate, then the bonding strength is sufficient for normal conditions, but peeling occurs under high temperature and stress
Solution Approach 1:
The patent applies surface treatment to the metal plates beforehand to create protrusions that interlock with the insulating substrate. This preliminary structural modification ensures that when the assembly is subjected to high temperature and stress, the mechanical interlocking prevents peeling and maintains bonding reliability without requiring additional bonding agents.
4Temperature
If fillers are added within the insulating substrate to enhance heat transfer, then heat dissipation performance improves, but the manufacturing process becomes more complex
Solution Approach 1:
The patent utilizes fillers with porous or granular structures that can be easily embedded within the insulating substrate during the manufacturing process. These fillers create multiple heat conduction paths and increase the heat transfer area without requiring complex processing steps, thereby improving heat transfer efficiency while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation performance by increasing the heat transfer area and shortening the heat transfer path, while enhancing bonding strength and reliability by dispersing external stress and preventing peeling, thus maintaining thermal equilibrium and preventing module destruction.
Implementation Method 1
a filler disposed within the insulating substrate and in contact with a lower surface of the first metal plate... improve heat dissipation performance by increasing the heat transfer area and shortening the heat transfer path
Implementation Method 2
a pin-fin structure disposed on the lower surface of the second metal plate... improve thermal conductivity and reliability
Implementation Method 3
improve heat dissipation performance... maintaining thermal equilibrium
Implementation Method 4
a bonding metal layer and a diffusion metal layer disposed between the first metal plate and the insulating substrate... enhancing bonding strength
Data Source
AI summary
A heat dissipation substrate for a power semiconductor module may include an insulating substrate; a first metal plate disposed on the insulating substrate; a second metal plate disposed under the insulating substrate; and a filler disposed within the insulating substrate. The filler may be in contact with a lower surface of the first metal plate.