Multi-layer Film Encapsulation for IC Stack Connectors
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving smaller size, lower cost, and higher functionality due to limitations in packaging density and solder joint reliability, particularly in package-on-package configurations, which often require costly and time-consuming processes like laser drilling and sawing.
Innovation Solution
The method involves using a multi-layer film with a base film layer, a penetrable film layer, and a penetrable adhesive to encapsulate stack connectors, exposing them for improved solder joint reliability, and forming an adhesive film layer by hardening the penetrable adhesive, which enhances mechanical and environmental protection while reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional package-on-package technologies are used to achieve higher packaging density, then the number of chips mounted on a substrate increases, but the manufacturing process becomes more complex and costly due to requirements for laser drilling and sawing
Solution Approach 1:
The patent extracts and eliminates the complex laser drilling and sawing steps from the manufacturing process. Instead of using these complex processes to create through-holes and separate packages, the invention uses a simplified flip-chip mounting approach with pre-formed interconnect structures that achieve the same packaging density without the complex manufacturing steps.
Solution Approach 2:
The patent segments the packaging structure into modular components: a substrate with arrayed mounting positions, individual chip packages with integrated interconnect structures, and a simplified assembly process. This segmentation allows each component to be prepared independently and assembled systematically, reducing overall manufacturing complexity while maintaining high packaging density.
2Object-affected harmful factors
If traditional encapsulation methods are used to protect stack connectors, then environmental protection is achieved, but solder joint reliability deteriorates due to poor access and contamination
Solution Approach 1:
The patent applies preliminary action by forming the encapsulation structure in a way that pre-establishes proper solder joint accessibility. The interconnect structures are designed and positioned before final encapsulation, ensuring that solder joints remain accessible and properly formed while still receiving environmental protection. This preliminary configuration prevents the need for later corrective operations.
Solution Approach 2:
The patent applies local quality by providing differentiated protection: the encapsulation material provides environmental protection in areas where it covers the stack connectors, while leaving solder joint areas accessible and uncontaminated. This localized approach ensures that each region receives the specific treatment it needs - protection where required and accessibility where critical for soldering.
3Manufacturing precision
If precise laser hole creation is used to improve connector alignment, then positioning accuracy increases, but manufacturing cost and time increase significantly
Solution Approach 1:
The patent uses preliminary action by pre-forming the interconnect structures with built-in alignment features during the chip package fabrication process. The stack connectors are positioned and secured with alignment marks or mechanical features that guide their placement on the substrate, eliminating the need for time-consuming laser drilling and alignment operations during final assembly.
Solution Approach 2:
The patent introduces an intermediary alignment mechanism - such as alignment marks, mechanical guides, or pre-positioned fiducial features - that mediates between the connector components and the substrate. This intermediary system provides precise alignment without requiring complex laser drilling operations, thereby reducing manufacturing time while maintaining positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves solder joint reliability and reduces manufacturing costs by simplifying the process, eliminating the need for precise laser hole creation and costly cleaning, while maintaining high packaging density and performance.
Implementation Method 1
forming an adhesive film layer by hardening the penetrable adhesive
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive.