Fine Bubble Liquid Polishing for CMP Stability and Pad Life
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Solution Overview
Problem
In semiconductor device manufacturing, increasing polishing pressure or processing time during chemical mechanical polishing (CMP) can lead to compromised substrate throughput and defects, while excessive dressing loads or rotational speeds shorten the polishing pad's life and affect the substrate's profile.
Innovation Solution
A polishing method and apparatus that utilize a fine bubble liquid with bubble diameters of 1 micrometer or less, supplied from a nozzle arm or atomizer, to stabilize the polishing process by enhancing cleaning power and extending pad life without damaging the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polishing pressure is increased to stabilize the polishing process, then polishing stability is improved, but substrate throughput is compromised and defects occur
Solution Approach 1:
The patent changes the physical and chemical parameters of the polishing liquid by introducing fine bubbles (1-100 micrometers) and ultrafine bubbles (1 micrometer or less). These bubble-containing liquids modify the polishing characteristics, allowing stable polishing processes at reduced pressures that maintain both reliability and productivity
2Reliability
If polishing pressure is increased to stabilize the polishing process, then polishing stability is improved, but defects occur on the substrate
Solution Approach 1:
The patent modifies the polishing liquid parameters by incorporating fine and ultrafine bubbles, which enable stable polishing processes at lower pressures. This prevents substrate defects while maintaining polishing stability, as the bubble-enhanced liquid provides effective polishing action without excessive mechanical stress
3Reliability
If dressing load is increased to stabilize the polishing process, then polishing stability is improved, but polishing pad life is shortened
Solution Approach 1:
The patent changes the liquid parameters by adding fine and ultrafine bubbles, which provide effective polishing and cleaning action. This reduces the need for frequent and intensive pad dressing, thereby extending polishing pad life while maintaining process stability
4Reliability
If rotational speed of the polishing table is increased to stabilize the polishing process, then polishing stability is improved, but polishing pad life is shortened and substrate profile is adversely affected
Solution Approach 1:
The patent modifies the polishing liquid by incorporating fine and ultrafine bubbles, which enhance the polishing effectiveness. This allows the process to achieve stability at lower rotational speeds, thereby extending polishing pad life and maintaining proper substrate profile without excessive speed-induced wear
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fine bubble liquid stabilizes the polishing process, improves substrate throughput, reduces defects, and extends the polishing pad's life by providing effective cleaning without damaging the substrate, even with reduced processing times and dressing loads.
Implementation Method 1
supplying a fine bubble liquid onto the polishing pad after finishing polishing the substrate
Implementation Method 2
the substrate is water polished to remove polishing debris and abrasive grains of the polishing liquid from a surface of the substrate
Data Source
AI summary
A polishing method capable of stabilizing a polishing process of a substrate is disclosed. In the polishing method, a fine bubble liquid is supplied onto a polishing pad after finishing polishing the substrate.