Fingerprint Recognition Module Flexible Substrate Integration
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Solution Overview
Problem
Conventional fingerprint recognition modules require multiple printed circuit boards, leading to increased thickness and size of electronic devices, poor bonding reliability, and difficulty in miniaturization due to the need for separate substrates and adhesive layers.
Innovation Solution
A fingerprint recognition module with a flexible circuit board for chip on film that integrates a fingerprint sensor and ASIC on a single substrate with a bending structure, allowing direct connection to the main board, reducing the number of substrates and adhesive layers, and incorporating a conductive pattern with a protective layer for improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple printed circuit boards are used to connect the fingerprint recognition module to the main board, then the module can be assembled with separate components, but the thickness and size of the electronic device increase
Solution Approach 1:
The patent combines the fingerprint recognition sensor, ASIC, and connection interface onto a single flexible substrate, eliminating the need for multiple separate printed circuit boards. This integration directly reduces device thickness while maintaining assembly capability, as the flexible substrate can be directly connected to the main board without requiring intermediate connection boards or adhesive layers between multiple rigid PCBs.
Solution Approach 2:
The patent employs a flexible substrate instead of rigid printed circuit boards to create a thin-film fingerprint recognition module. This flexible substrate can be directly bonded to the main board, eliminating the thickness contributed by multiple rigid PCB layers and adhesive materials, thereby solving the contradiction between assembly flexibility and device thickness.
2Ease of manufacture
If multiple printed circuit boards are used in the fingerprint recognition module, then component separation is achieved, but bonding reliability deteriorates due to poor bonding between multiple boards
Solution Approach 1:
The patent merges the fingerprint sensor, ASIC, and connection interface onto a single flexible substrate, eliminating the multiple bonding interfaces that exist when using separate printed circuit boards. By reducing the number of bonding locations from multiple PCB-to-PCB connections to a single substrate-to-main-board connection, the patent significantly improves bonding reliability while still achieving functional separation of components on the same substrate.
3Ease of manufacture
If multiple printed circuit boards and adhesive layers are required, then modular assembly is enabled, but device miniaturization is limited due to increased size
Solution Approach 1:
The patent combines multiple functional elements (fingerprint sensor, ASIC, connection interface) onto a single flexible substrate, eliminating the need for multiple separate printed circuit boards and adhesive layers. This integration dramatically reduces the overall volume and size of the fingerprint recognition module, enabling device miniaturization while preserving modular assembly capabilities through the flexible substrate design.
Solution Approach 2:
The use of a flexible substrate instead of multiple rigid printed circuit boards eliminates the cumulative thickness and volume of multiple board layers and adhesive materials. This thin-film approach enables significant size reduction of the fingerprint recognition module, directly supporting device miniaturization objectives.
Data Source
AI summary
A fingerprint recognition module according to an embodiment comprises: a substrate; a conductive pattern portion disposed on the substrate; a protective layer partially disposed on one region of the conductive pattern portion; a first chip disposed on the conductive pattern portion exposed through a first open region of the protective layer; and a second chip disposed on the conductive pattern portion exposed through a second open region of the protective layer, wherein the first chip is a fingerprint recognition sensor, the second chip is an application specific integrated circuit, the substrate includes a first non-bending region located at one end thereof, a second non-bending region located at the other end opposite to the one end, and a bending region located between the first and the second non-bending region, the first open region is located on the first non-bending region, and the second open region is located on the second non-bending region.