Fingerprint Sensor Package with ESD Bezel and Integrated LEDs

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Solution Overview

Problem

Current fingerprint sensor packaging methods are costly and lack innovative features to enhance user verification and device aesthetics in consumer devices.

Innovation Solution

A full cavity fingerprint sensor package is developed using a high volume low cost assembly technique, incorporating a dielectric protective coating, electrically conductive bezel for ESD discharge, and integrated light emitting diodes for visual feedback, with a silicon die fingerprint sensor mounted on a substrate and encapsulated in a package body, allowing for colored design and robust protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional fingerprint sensor packaging methods are used, then the sensor is protected and functional, but the packaging cost is high

Engineering Contradiction:
Improvepackaging costVSAvoidsensor protection
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The packaging structure is divided into distinct functional layers: a substrate providing mechanical support, a protective coating layer for environmental protection, and an integrated LED assembly for visual feedback. This segmentation allows each layer to be optimized independently for cost and function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines multiple functions into a single integrated package: the substrate serves as both structural support and mounting platform, the protective coating provides both protection and optical properties, and LEDs are integrated directly into the package structure. This merging reduces the need for separate components and assembly steps, lowering packaging costs.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If additional features like ESD discharge and visual feedback are added, then user experience is enhanced, but device complexity increases

Engineering Contradiction:
Improveuser experience featuresVSAvoidpackage structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The substrate serves multiple functions simultaneously: mechanical support, mounting platform for the sensor and LEDs, and structural element for the package. The protective coating provides both environmental protection and optical properties for the LEDs. This multi-functionality reduces the need for additional dedicated components, maintaining simplicity while adding features.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The electrically conductive bezel provides ESD discharge functionality as an integrated feature of the package structure, eliminating the need for separate ESD protection components. The LEDs are directly mounted on the substrate and integrated into the package body, providing visual feedback without requiring external housing or additional mounting structures.

Inventive Principle:
Principle #25Self-service

3Strength

If the sensor is fully encapsulated for robust protection, then resistance to external damage is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improverobustness against damageVSAvoidencapsulation precision
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The substrate and protective coating are designed to provide mechanical protection and environmental sealing before the sensor is fully assembled into the device. This pre-protection approach allows for standard manufacturing tolerances while still providing robust protection, as the protective structures are in place before the sensor is subjected to final assembly stresses.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces packaging costs while enhancing device attractiveness and user experience through effective fingerprint sensing and visual feedback, ensuring robustness against external damage and electrostatic discharge.

Implementation Method 1

an electrically conductive bezel 138 that discharges electrostatic discharge (ESD)

Methodology Applied
Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Implementation Method 2

integrated light emitting diodes 146A, 146B for visual feedback

Methodology Applied
Scientific EffectLight Emitting Diode: Light Emitting Diode

Data Source

PatentUS8717775B1Fingerprint sensor package and method
Publication Date: 2014.05.06 AMKOR TECH SINGAPORE HLDG PTE LTD
  • US8717775B1 patent drawing
  • US8717775B1 patent drawing
  • US8717775B1 patent drawing

AI summary

A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges electrostatic discharge (ESD). Both the protective coating and the bezel can be colored to have desired colors. Accordingly, the flat surface can be colored as desired enhancing the attractiveness for consumer applications. Further, light emitting diodes are integrated into the fingerprint sensor package providing a visual feedback to the user that the user's fingerprint has been successfully sensed. Further, the fingerprint sensor package is formed using a high volume low cost assembly technique.