Fingerprint Sensor Electrode Hole Geometry and Adhesive Bonding
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Solution Overview
Problem
Current fingerprint identification devices face challenges in efficiently integrating sensor electrodes with a substrate and processing unit while maintaining effective signal transfer and protection, particularly in terms of hole geometry and material compatibility.
Innovation Solution
The device incorporates a substrate with strategically defined holes and sub-holes of specific shapes and angles, filled with adhesive layers, and uses diamond-like carbon or amorphous diamond for the contact layer, along with transparent or metal conductive sensor electrodes, to ensure secure and efficient signal transfer between the sensor electrodes and processing unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensor electrodes pass through through holes in the substrate, then signal transfer between sensor electrodes and processing unit is enabled, but structural integrity and protection of sensor electrodes are compromised
Solution Approach 1:
The patent implements a nested structure where sub-holes are positioned within the larger through holes that pass through the substrate. This nested arrangement allows sensor electrodes to pass through the through holes while the sub-holes filled with adhesive provide additional support and protection, maintaining both signal transfer capability and structural integrity.
Solution Approach 2:
The patent uses composite material construction by filling the sub-holes with adhesive material that bonds the sensor electrodes to the substrate. This composite approach combines the conductive properties of the sensor electrode material with the adhesive properties of the filling material, achieving both electrical connection and mechanical strength.
2Strength
If adhesive layers are used to fill holes and sub-holes, then protection and structural integrity are improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary action by pre-defining the holes and sub-holes in the substrate before inserting the sensor electrodes. This pre-prepared structure allows for systematic adhesive filling and ensures proper positioning, thereby reducing overall manufacturing complexity despite the multi-step process.
Solution Approach 2:
The patent segments the hole structure into two distinct components: through holes for electrode passage and sub-holes for adhesive support. This segmentation allows each component to be optimized independently - through holes for electrical connection and sub-holes for mechanical support - simplifying the overall manufacturing approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the protection of sensor electrodes, improves signal detection, and maintains the structural integrity of the device, enabling effective fingerprint identification with improved durability and reliability.
Implementation Method 1
the substrate has a plurality of holes passing through the substrate, and each of the holes has a corresponding one of the sub-holes defined in the substrate... filled with adhesive layers
Implementation Method 2
uses diamond-like carbon or amorphous diamond for the contact layer
Implementation Method 3
transparent or metal conductive sensor electrodes, to ensure secure and efficient signal transfer between the sensor electrodes and processing unit
Data Source
AI summary
The present disclosure provides a fingerprint identification device including a substrate, a contact layer, a processing unit, and a plurality of sensor electrodes. The substrate includes a first sub-substrate, a second sub-substrate, and an adhesive layer. The adhesive layer is between the first sub-substrate and the second sub-substrate. A plurality of first sub-holes is defined in the first sub-substrate. A plurality of second sub-holes is defined in the second sub-substrate. A plurality of third sub-holes is defined in the adhesive layer. One of the first sub-holes communicates a corresponding one of the third sub-holes and a corresponding one of the second sub-holes to define a corresponding hole. An end of each of the sensor electrodes is coupled to the processing unit. The other end of each of the sensor electrodes passes through one of the holes, extends to the contact layer, and is covered by the contact layer.