Fixing Heater Element Layout for Substrate Crack Prevention

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Solution Overview

Problem

Existing fixing devices face issues with substrate damage due to opposing thermal expansion forces between resistance heating elements, which are arranged in a stepped manner to ensure insulation but can exceed safe displacement limits, leading to potential substrate cracking.

Innovation Solution

The arrangement of resistance heating elements on the substrate is optimized with a displacement amount between elements set to less than the pressure region dimension, ranging from 0.1 mm to 4.5 mm, ensuring effective insulation while minimizing thermal expansion-induced substrate damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If resistance heating elements are arranged in a stepped manner with large displacement to ensure insulation distance, then insulation between adjacent heating elements is improved, but substrate damage occurs due to excessive thermal expansion forces

Engineering Contradiction:
Improveinsulation distanceVSAvoidsubstrate integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent optimizes the displacement parameter between adjacent resistance heating elements to a specific range (0.1 mm to 4.5 mm). This parameter change balances two competing requirements: maintaining sufficient insulation distance to prevent electrical breakdown while limiting thermal expansion forces to prevent substrate damage. By carefully controlling this dimensional parameter, the invention resolves the contradiction between insulation reliability and substrate strength.

Inventive Principle:
Principle #35Parameter changes

2Volume of moving object

If resistance heating elements are arranged in a stepped manner to make the heating body compact, then device size is reduced, but substrate damage risk increases due to thermal expansion forces

Engineering Contradiction:
Improveheating body sizeVSAvoidsubstrate integrity
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The patent specifies an optimal displacement range (0.1 mm to 4.5 mm) between adjacent heating elements that allows the heating body to remain compact while preventing substrate damage. This parameter optimization enables space-efficient design without compromising substrate integrity, even when heating elements are positioned close together in a stepped arrangement.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent acknowledges that thermal expansion forces are inherently harmful when heating elements are closely spaced, but converts this challenge into a design criterion by specifying the optimal displacement range. By carefully controlling the spacing parameter, the invention transforms the potential harm of thermal expansion into a manageable design parameter that enables compact construction while protecting the substrate.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Strength

If displacement between resistance heating elements is increased to prevent substrate damage, then thermal expansion forces are reduced, but insulation distance may become insufficient

Engineering Contradiction:
Improvesubstrate integrityVSAvoidinsulation distance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent defines a precise displacement range (0.1 mm to 4.5 mm) that simultaneously satisfies both substrate protection and insulation requirements. This optimized parameter ensures that heating elements are close enough to minimize thermal expansion forces on the substrate while maintaining sufficient insulation distance to prevent electrical breakdown, thereby resolving the contradiction between these two requirements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces substrate damage by managing thermal expansion forces, allowing for a compact and efficient heating system that adapts to various paper sizes with minimal power consumption.

Implementation Method 1

The heater includes a plurality of resistance heating elements formed on one surface of a substrate

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

heats the fixing belt

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The pressure member forms a pressure region between the fixing belt and the pressure member, and pressurizes the toner on the medium passing through the pressure region

Methodology Applied
Scientific EffectMechanical pressure: Pressure Increase

Data Source

PatentUS20260064055A1Fixing device and image forming apparatus
Publication Date: 2026.03.05 KYOCERA DOCUMENT SOLUTIONS INC
  • US20260064055A1 patent drawing
  • US20260064055A1 patent drawing
  • US20260064055A1 patent drawing

AI summary

A fixing device includes a fixing belt, a pressure member, and a heater. The heater includes a plurality of resistance heating elements formed on one surface of a substrate at intervals in the axial direction. The resistance heating elements contain at least one first resistance heating element, and at least one second resistance heating element formed at a position displaced from the first resistance heating element on an upstream side or on a downstream side of the first resistance heating element in a medium conveyance direction orthogonal to the axial direction. A displacement amount between the first resistance heating element and the second resistance heating element is less than a dimension of the pressure region in the conveyance direction, and is set in a range of 0.1 mm or larger to less than 4.5 mm.