Flameproof Vent Housing With Heat-Expandable Flow Channel Sealing

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Solution Overview

Problem

Existing electronic devices in data centers with battery energy storage systems face the risk of high temperature combustible gases escaping through vents, potentially igniting surrounding systems due to thermal runaway situations in lithium battery cells, violating safety requirements.

Innovation Solution

A flameproof electronic device with a housing and thermal-expandable structure that seals vents when heated above a predetermined temperature, using materials like Rainbow FM-900 thermal expansion paint to form a foam layer that expands to block airflow and extinguish flames.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If vents are provided on the housing for heat dissipation, then the electronic device can effectively dissipate heat, but high temperature combustible gases and flames can escape through the vents during thermal runaway, increasing ignition risk

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidignition risk from escaping flames
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by using a thermal-expandable structure that changes its physical state based on temperature. At normal temperatures, the structure remains compact allowing heat dissipation through vents. When temperature reaches a threshold during thermal runaway, the structure expands to seal the vents, preventing flame escape while maintaining heat dissipation under normal conditions

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements dynamics by using a dynamic sealing mechanism that transitions from an open state (allowing heat dissipation) to a closed state (preventing flame escape). The thermal-expandable structure dynamically adjusts the vent opening based on temperature conditions, transforming the static vent design into a dynamically responsive system that adapts to different thermal states

Inventive Principle:
Principle #15Dynamics

2Temperature

If the electronic assembly is separated from the housing to create a flow channel, then heat dissipation efficiency is improved, but the structure complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies segmentation by separating the electronic assembly from the housing to create distinct flow channels for heat dissipation. This segmentation allows independent optimization of the cooling path while maintaining a relatively simple overall structure. The separation creates dedicated airflow passages without requiring complex internal cooling channels within the housing itself

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents the escape of high temperature gases and flames, reducing the risk of ignition and enhancing safety by sealing vents and suppressing combustion, thus meeting safety requirements.

Implementation Method 1

The thermal-expandable structure expands to seal the corresponding vent when being heated to greater than or equal to a predetermined temperature

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

using materials like Rainbow FM-900 thermal expansion paint to form a foam layer that expands to block airflow and extinguish flames

Methodology Applied
Scientific EffectHeat absorption: Absorption (physical)

Data Source

PatentUS20260000924A1Flameproof electronic device
Publication Date: 2026.01.01 DELTA ELECTRONICS INC(CN)
  • US20260000924A1 patent drawing
  • US20260000924A1 patent drawing
  • US20260000924A1 patent drawing

AI summary

This disclosure is directed to a flameproof electronic device having a housing, an electronic assembly, and a thermal-expandable structure. The housing has a pair of vents. The electronic assembly is accommodated in the housing, at least a part of the electronic assembly is spaced from the housing to enclose a flow channel between the electronic component and an internal surface of the housing, and the flow channel communicates with the vent. The thermal-expandable structure covers the internal surface of the housing or an external surface of the electronic assembly. The heat-expandable structure expands to block the flow channel when being heated to greater than or equal to a predetermined temperature.