Flash Lamp Detachment for Flexible Sensor Arrays
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Solution Overview
Problem
Existing methods for manufacturing flexible substrate sensor arrays often damage the arrays when detaching the carrier substrate, leading to higher costs and lower quality products due to the use of expensive and complex excimer lasers.
Innovation Solution
A method involving a flash lamp is used to detach the flexible substrate from the carrier glass substrate, with a reflective metal layer and heat buffer layers protecting the active layers from heat damage, allowing for a less expensive and space-efficient manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If excimer laser is used to detach the flexible substrate from the carrier glass substrate, then the detachment can be achieved, but the manufacturing cost increases and the equipment occupies more space
Solution Approach 1:
The patent replaces the expensive excimer laser with a flash lamp, which is a more economical light source. The flash lamp achieves the same detachment function through a different mechanism (broad-spectrum light absorption by the black silicon layer) without requiring the high cost and large footprint of excimer laser equipment
Solution Approach 2:
The patent changes the wavelength parameter of the light source from the specific ultraviolet wavelength of excimer lasers to broad-spectrum light from a flash lamp. This parameter change, combined with the black silicon layer design, achieves effective detachment using cheaper equipment
2Reliability
If excimer laser is used to detach the flexible substrate from the carrier glass substrate, then the detachment can be achieved, but the equipment occupies more area in the clean room
Solution Approach 1:
The flash lamp equipment is significantly more compact than excimer laser systems, reducing the clean room area required for the detachment process while maintaining effective substrate release
3Ease of manufacture
If flash lamp is used to detach the substrate, then the manufacturing cost is reduced and equipment space is minimized, but the active layers may be damaged by heat
Solution Approach 1:
The patent applies selective light absorption properties to different layers: the black silicon layer absorbs broad-spectrum light from the flash lamp and converts it to heat, while the heat buffer layers selectively protect the active device layers from this heat, achieving localized thermal management that enables detachment without damaging sensitive components
Solution Approach 2:
The heat buffer layers act as intermediary protective elements between the flash lamp heat source and the active device layers, absorbing and dissipating heat to prevent damage to the sensitive active layers during the detachment process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and improves the quality of flexible sensor arrays by effectively detaching the substrate without damaging the active layers, using a less expensive and more compact setup compared to traditional excimer laser methods.
Implementation Method 1
exposing the sensor array to light from a flash lamp
Implementation Method 2
exposing the sensor array to light from a flash lamp and then detaching the carrier glass substrate
Implementation Method 3
forming a mirror layer over the first heat buffer layer
Implementation Method 4
forming a first heat buffer layer over the amorphous silicon layer; forming a second heat buffer layer over the mirror layer
Data Source
AI summary
A method of manufacturing a sensor array includes providing a carrier glass substrate, forming an amorphous silicon layer over the carrier glass substrate, forming a first heat buffer layer over the amorphous silicon layer; forming a mirror layer over the first heat buffer layer; forming a second heat buffer layer over the mirror layer; forming a flexible substrate over the second heat buffer layer; and forming an active device layer over the flexible substrate. The method of the present invention further comprises exposing the sensor array to light from a flash lamp and then detaching the carrier glass substrate from the sensor array. The method of the present invention optionally further comprises filtering the light from the flash lamp to wavelengths below 350 nm.