Flat Panel Detector Assembly for Selective Pixel Readout
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Solution Overview
Problem
Existing large area flat panel image sensors for X-ray imaging and radiation detection are limited by sequential row-by-row readout methods, which do not allow for selective or patterned readouts, leading to inefficiencies and image stitching requirements.
Innovation Solution
An image sensor unit with individually addressable pixels, controlled by row and column control circuitry and a unit controller, enabling selective readout of specific pixel patterns, and incorporating memory for predefined readout patterns and signal amplification, allowing for flexible and efficient data acquisition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential row-by-row readout method is used, then device complexity is reduced, but productivity is worsened due to inability to perform selective or patterned readouts
Solution Approach 1:
The pixel array is divided into multiple independently controllable rows and columns, allowing selective readout of specific regions. The control circuitry is segmented into row control circuits and column control circuits that can be independently activated, enabling patterned readout without requiring full-array readout, thus improving productivity while managing complexity through modular control.
Solution Approach 2:
The readout system transitions from a static sequential row-by-row method to a dynamic selective readout method where specific rows and columns can be dynamically chosen based on imaging requirements. The unit controller dynamically configures which pixels are read out, allowing adaptive optimization of readout efficiency for different application scenarios.
2Area of stationary object
If multiple sensors are butted together to form large area detector, then area of stationary object is improved, but loss of information is worsened due to stitching requirements
Solution Approach 1:
Multiple image sensor units are combined to form a large area flat panel detector with a unified coordinate system. The sensors are arranged in an extended array where pixels from different physical sensors are logically merged into a single continuous pixel matrix, eliminating the need for post-acquisition stitching and preventing information loss at boundaries.
Solution Approach 2:
The large area detector provides universal coverage for various imaging applications by combining multiple sensors into a single detector unit. The unified addressing scheme allows the entire extended area to be treated as one continuous sensing surface, enabling flexible selective readout across the full imaging area without being constrained by individual sensor boundaries.
3Adaptability or versatility
If image chip based detectors are arranged in offset manner, then adaptability is improved, but device complexity is worsened due to sliding or rotating requirements
Solution Approach 1:
The patent replaces mechanical manipulation methods (sliding, rotating, stitching) with an electronic addressing system. The unified coordinate system and selective readout capability allow any pattern of pixels to be accessed electronically without physical movement or mechanical manipulation of the detector or image chips, thereby reducing device complexity while maintaining adaptability.
Data Source
AI summary
An image sensor unit is disclosed that includes an array of image sensing pixels, arranged in a plurality of rows and a plurality of columns, wherein each pixel is individually addressable. Each row of pixels is controlled via a row control in communication with the row of pixels in the array via a row addressing line, and capable of selectively addressing one or more of the plurality of rows. Each column of pixels is controlled by a column control in communication with each column of pixels in the array via a column addressing line, and capable of selectively addressing one or more of the plurality of columns. A unit controller is configured to specify selective readout of one or more pixel readout signals by instructing the row and column control to address one or more specific rows and columns of the array.A flat panel image sensor may include image sensor chips mounted on a substrate, the substrate may include a plurality of openings, and each of the plurality of openings enables access to at least one image sensor unit of the image sensor units. Each image sensor chip may include at least one chip contact array where at least one contact of each image sensor unit is accessible through at least one opening. The flat panel image sensor also may include a printed circuit board (“PCB”) attached to the substrate, which includes PCB contact arrays and each PCB contact array may be in alignment with and in electrical connection with a corresponding chip contact array using electrically adhesive paste. The substrate and the PCB may be aligned so that each ball of electrically conductive adhesive paste is in contact with one electrical contact pad to form an image sensor assembly.