Flat Covered Wire Coating Structure for Adhesion and Dielectric Balance

The coating layer is divided into three distinct layers: a first layer formed from liquid coating material containing polymer compounds with amide or imide groups, a second layer formed from liquid or powder coating material containing polymer compounds with amide or imide groups and fluorine-containing polymer compounds, and a third layer formed by extrusion of fluorine-containing polymer compound. This segmentation allows each layer to perform specific functions - the first layer provides adhesion to the substrate, the second layer provides intermediate bonding and insulating properties, and the third layer provides the final insulating protection with low dielectric constant.

The patent uses composite materials in the coating layers, particularly in the second layer which combines polymer compounds with amide or imide groups and fluorine-containing polymer compounds. The polymer compounds with amide or imide groups provide strong adhesion to the metal substrate, while the fluorine-containing polymer compounds provide low dielectric constant and good insulating properties. This composite approach resolves the contradiction between adhesion strength and insulating performance.

Different layers of the coating have different local qualities tailored to their specific functions. The first layer uses polymer compounds with amide or imide groups that have high adhesion to metal surfaces. The second layer combines adhesion-promoting polymer compounds with fluorine-containing polymer compounds that have low dielectric constant. The third layer uses fluorine-containing polymer compound for low dielectric constant and excellent insulating properties. This local differentiation allows each layer to optimize for its primary function while contributing to overall performance.

The patent changes the chemical composition parameters of each coating layer to achieve the desired balance between adhesion and dielectric properties. The first layer uses polymer compounds with specific functional groups (amide or imide) for adhesion. The second layer adjusts the ratio and types of polymer compounds and fluorine-containing polymers to balance adhesion and dielectric constant. The third layer uses fluorine-containing polymer compound with optimized composition for low dielectric constant. These parameter changes resolve the contradiction by allowing adhesion optimization in the first layer and dielectric optimization in the third layer.