Multi-Die Building Block Using Flex Tape for Stacked Packages
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Solution Overview
Problem
Conventional semiconductor packaging methods, such as C4 solder ball connections and wire-bonding, are limited in accommodating stacked die configurations and do not easily allow for the integration of multiple semiconductor die within a single package, especially when considering size constraints and structural issues.
Innovation Solution
The use of multi-die building blocks with flex tape, where each die is coupled to the tape's electrical traces via interconnects, allowing for the stacking of semiconductor die and reducing the need for conventional wire-bonding, enabling easier integration of memory and logic die of varying sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If C4 solder ball connections are used for flip chip interconnections, then direct substrate connection is achieved, but mounting area size limits the number of die that can be accommodated
Solution Approach 1:
The patent transitions from a two-dimensional planar mounting approach to a three-dimensional stacked configuration. By stacking multiple building blocks vertically, the system accommodates more die without increasing the substrate's footprint, effectively utilizing the vertical dimension to overcome mounting area constraints.
Solution Approach 2:
The system is divided into modular building blocks, each containing multiple die stacked together. This segmentation allows the large number of die to be organized into manageable units that can be independently handled and assembled on the substrate, simplifying the mounting process while increasing capacity.
2Ease of manufacture
If conventional wire-bonding approaches are used, then interconnections are established, but the number of die that can be included in a single package is limited
Solution Approach 1:
Multiple die are merged into a single building block unit through direct stacking and bonding. This consolidation reduces the complexity of interconnections by establishing connections at the building block level rather than between individual die, enabling a greater quantity of die to be included in a single package.
Solution Approach 2:
Die are nested within building blocks in a stacked configuration, with multiple die contained within each building block. This nesting approach allows a high density of die to be packed into a compact volume, significantly increasing the number of die that can be included in a single package.
3Productivity
If stacked die configurations are attempted with conventional methods, then vertical integration is achieved, but structural issues arise
Solution Approach 1:
Die are pre-assembled into building blocks with established interconnections before being mounted on the substrate. This preliminary assembly ensures proper alignment and bonding between die, preventing structural issues that would arise from attempting to stack and connect individual die directly on the substrate.
Solution Approach 2:
Building blocks serve as intermediary units between the substrate and the stacked die. These intermediaries provide a stable platform for vertical integration, distributing mechanical stresses and ensuring reliable connections between multiple die layers without compromising structural stability.
Data Source
AI summary
A multi-die building block for a stacked-die package is described. The multi-die building block includes a flex tape having a first surface and a second surface, each surface including a plurality of electrical traces. A first die is coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape. A second die is coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape.