Flexible Array Substrate Via Holes Stress Diffusion
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Solution Overview
Problem
Flexible display apparatuses face stress issues on inorganic layers when bent, leading to potential irreparable damage and display impairment due to insufficient stress release at small radii of curvature.
Innovation Solution
A flexible array substrate structure is developed, featuring continuous first via holes between adjacent thin film transistors filled with flexible organic material, which acts as a stress diffuser, ensuring the layers remain endurable during bending by distributing stress across four sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible display apparatus is bent with a small radius of curvature, then the flexibility and portability are improved, but stress on the inorganic layer increases causing potential damage
Solution Approach 1:
The patent introduces first via holes between adjacent thin film transistors that divide the continuous inorganic layer into separate segments. This segmentation allows stress to be localized and released at the via hole regions, preventing stress propagation across the entire inorganic layer during bending, thus resolving the contradiction between flexibility and stress resistance
Solution Approach 2:
The patent fills the first via holes with flexible organic material to create a porous structure in the inorganic layer. This porous design provides stress release pathways while maintaining the structural integrity of the inorganic layer, enabling the display to withstand small radius bending without damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the bending endurance of flexible display panels, allowing them to maintain functionality even at small radii of curvature without causing damage to the inorganic layers.
Implementation Method 1
The structure immediately diffuses stress to four sides when the flexible display apparatus is bent, and the adjacent thin film transistors do not influence each other
Data Source
AI summary
A flexible array substrate and a manufacturing method thereof are provided. The array substrate includes a glass substrate, a flexible base substrate, a buffer layer, an active layer, a gate insulating layer, a first metal layer, an interlayer insulating layer, a flexible organic layer, a second metal layer and a passivation layer. The flexible organic layer includes at least two first via holes, and the first via holes sequentially pass through the interlayer insulating layer, the gate insulating layer and the buffer layer.